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Analysis of Hot Spots in ULSI Interconnect and Via Systems

PEI Song-wei, HUANG He, HE Xu-shu, BAO Su-su (School of Computer, South China Normal University, Guangzhou 510631, China)  
Hot spot is one of the most important factors to the performance and reliability of ULSI。An analytical thermal model for estimating the positions and temperatures of hot spot in interconnect and via systems is presented, and comparing the positions and temperatures of hot spots in different via diameters and via heights in the paper. It has been shown that via diameter and via height have important effects on the hot spot of interconnect and via systems.
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