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《Journal of Xidian University》 2005-04
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State of the arts Cu interconnect and its reliability in ULSI

HAO Yue~1,SHAO Bo-tao~1,MA Xiao-hua~1,HAN Xiao-liang~1,WANG Jian-ping~2(1. Research Inst. of Microelectronics, Xidian Univ., Xi′an 710071, China; 2. SMIC, Shanghai 201203, China)  
With the development of higher integration and reliability of IC, the reliability of copper interconnects is more important than ever. In this paper, the key processes of Cu interconnects are analyzed and compared, and the author lay emphasis on the development of the Cu interconnect and Cu vias. The present problems and discussions of fundamental reliability units of Cu interconnects are introduced. Lastly, some methods are given to solve these key problems in Cu interconnects.
【Fund】: 国家“863”计划资助项目(2003AA1Z1630)
【CateGory Index】: TN405
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