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《Piezoelectrics & Acoustooptics》 2010-03
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Key Technologies of Micro-electromechanical System and Its Recent Progress

ZHANG Dongzhi,HU Guoqing (School of Mechanical and Automotive Engineering,South China University of Technology,Guangzhou 510640,China)  
Micro-electromechanical system(MEMS),developed on the basis of microelectronics,is a scientific research frontier of multi-disciplines and assimilates the most advanced achievements in current research and development.MEMS extends into various fields with wide application prospects,such as automotive electronics,aeronautics and astronautics,information communication,biomedicine,auto-control and defense industry,et al.This paper introduces the background of MEMS development and its basic theory research.The key technologies of MEMS such as device design,fabricating material,three advanced machining processes(silicon micromachining,precision micromachining and LIGA technique),micro-packaging and testing are reviewed.Further more,the typical applications and latest development in fields including micro/nano-sensor,micro-actuator,micro-robot,micro air vehicle,micro-power energy system,micro biological chip are discussed,and lastly the future development of MEMS is put forward.A good many of advanced MEMS devices are hopeful put into practicality and industrialization from laboratory in recent decades.
【Fund】: 华南理工大学优秀博士学位论文创新基金资助项目(200903023);; 国家留学基金委员会资助项目(2009615035)
【CateGory Index】: TP211.4
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【Citations】
Chinese Journal Full-text Database 10 Hits
1 ZHANG Yi,LUO Yuan,XU Xiao-dong(School of Automatization,Chongqing University of Posts and Telecommunications,Chongqing 400065,CHN);Analysis and Simulation for Micro-mirror of MEMS Optical Switch Based on Fractal Theory[J];Semiconductor Optoelectronics;2006-06
2 MEI Nian-song,HUANG Qing-an (Key Laboratory of MEMS of Education Ministry,Southeast University,Nanjing210096,China);Beam test structure of MEMS for measuring fracture strength[J];Semiconductor Information;2002-12
3 CHEN Bing-ya1,2,LIU Ying1,HU Min1,LI Xiao-bing1,LI Yi-bing1,WANG Qiang1(1.School of Mechanical & Electrical Engineering,Nanchang University,Nanchang 330029,China;2.Depavtment of Test and Control Engineering,Nanchang Institute of Aeronautical Technology,Nanchang 330063,China);The Research and Prospect of Microactuator[J];Micronanoelectronic Technology;2005-12
4 Huang Qing’an,Liu Zutao,Li Weihua,and Li Qiaoping(Key Laboratory of MEMS of the Ministry of Education,Southeast University,Nanjing 210096,China);A Test System for the in situ Extraction of the Material Parameters of MEMS Thin Films[J];Chinese Journal of Semiconductors;2006-09
5 HU Xue-mei,LJun-xia(Department of Electrical Engineering,Henan Polytechnic Institute,Nanyang 473009,China);MEMS packaging technology[J];Transducer and Microsystem Technologies;2006-12
6 SHEN Hong-yuan,CHU Jin-kui,ZHANG Duan-qin,LUO Ru-lin(Key Laboratory for Micro /Nano Technology and System of Liaoning Province,Key Laboratory for Precision & Non-traditional Machining,Ministry of Education,Dalian University of Techonology,Dalian 116023,China);Study of off-chip tensile test experimental facility for micro-component mechanical property[J];Transducer and Microsystem Technologies;2007-07
7 RONG Hua~1,2,HUANG Qing-an~2,WANG Ming~1(1.Jiangsu Province Key Laboratory of Optoelectronic Technology,Nanjing Normal University,Nanjing,Jiangsu 210097,China;2.Key Laboratory of MEMS of Education Ministry,Southeast University,Nanjing,Jiangsu 210096,China);A Method for In-Situ Measuring Average Stress Gradient and Elastic Modulus of a MEMS Film[J];Acta Electronica Sinica;2007-02
8 LI Zhi, WANG Xiang-jun (National Laboratory of Precision Measurement Technology and Instruments,College of Precision Instrument and Opto-electronic Engineering, Tianjin University, Tianjin 300072, China);MEMS measurement technologies and methods[J];Optics and Precision Engineering;2003-01
9 LOU Xia1,JIN Xin2,JIN Yu-feng1,2,LI Zhi-hong2(1.Peking University,Shenzhen Graduate School,Shenzhen 518055,China;2.National Key Laboratory of Nano/Micro Fabrication TechnologyInstitute of Microelectronics,Peking University,Beijing 100871,China);A strategy of wafer-level-plastic-packaging for MEMS based on adhesive bonding[J];Journal of Functional Materials and Devices;2008-02
10 WANG Liding~(1,2) CHU Jinkui~(1,2) LIU Chong~(1,2) LUO Yi~2 (1.Key Laboratory for Precision and Non-traditional Machining Technology of Ministry of Education,Dalian University of Technology,Dalian 116023;2.Key Laboratory for Micro/Nano Technology and System of Liaoning Province,Dalian University of Technology,Dalian 116023);New Developments on Micro-nano Manufacture Technology in China[J];Chinese Journal of Mechanical Engineering;2008-11
【Co-citations】
Chinese Journal Full-text Database 10 Hits
1 MEI Nian song,HUANG Qing an (Key Laboratory of MEMS of Education Ministry,Southeast University,Nanjing210096,China);A new structure for measuring MEMS films fracture strength——thermal actuator[J];Micronanoelectronic Technology;2003-Z1
2 KONG Xiang-dong1,2,ZHANG Yu-lin1,SONG Hui-ying1,LU Wen-juan1(1.Institute of Electron Beam,Shandong University,Jinan 250061,China;2.Dongying Polytechnic Institute,Dongying 257091,China);MEMS micro-processing technologies[J];Micronanoelectronic Technology;2004-11
3 Mei Niansong and Huang Qing'an(Key Laboratory of MEMS of Education Ministry,Southeast University,Nanjing 210096,China);Modeling and Simulation of a Test Structure for Measuring Vertical Fracture Strength of MEMS Film[J];Chinese Journal of Semiconductors;2004-01
4 LIU Xudong1,2,ZHU Rong2 ,XU Lijun2,ZHANG Fuxing2,LIU Peng2,ZHOU Zhaoying2 1.Key Laboratory of the Electronic Measurement Technology of the National Defense,North University of China,Taiyuan 030051,China; 2.State Key Laboratory of Precision Measurement Technology and Instruments,Tsinghua University,Beijing 100084,China;Research on Flow Sensor System Integrated with Wing of Micro Air Vehicle[J];Chinese Journal of Sensors and Actuators;2009-07
5 HU Xue-mei,LJun-xia(Department of Electrical Engineering,Henan Polytechnic Institute,Nanyang 473009,China);MEMS packaging technology[J];Transducer and Microsystem Technologies;2006-12
6 CHEN Bing-ya1,2,LIU Ying1,HU Min1,LI Xiao-bing1,LIU Zhi-yong1(1.School of Mechanical and Electronic Engineering,Nanchang University,Nanchang 330029,China;2.Department of Testing and Control Engineering,Nanchang Institute of Aeronautical Technology,Nanchang 330063,China);Study on experimental apparatus of thermal expansion characteristics of paraffin[J];Transducer and Microsystem Technologies;2007-12
7 ZHANG Xue-fen, CHEN Xu (School of Chemical Engineering and Technology of Tianjin University, Tianjin 300072, China);Radiating Technology of Power Electronics[J];Electronics & Packaging;2007-06
8 LV Gui-zhi, REN Gong-chang, DING Tao(College of Mechanical and Electrical Engineering, Shaanxi University of Science & Technology, Xi,an 710021, China);Analysis on evolution of dispensing system base on TRIZ technology[J];Journal of Engineering Design;2008-05
9 CHEN Li-guo,YANG Zhi-Liang,MA Ling-Yu,SUN Li-ning(Robotics Institute,Harbin Institute of Technology,Harbin 150080,China);Automatic wire bonding system for MEMS sensor packaging[J];Journal of Functional Materials and Devices;2008-02
10 DU Xiao-qing1,2,WEN Zhi-yu1,2,LIU Hai-tao2,ZHAO Fu1,2(1.Key Laboratory of Optoelectronic Technology and Systems of the Education Ministry of China,Chongqing 400044,China;2.Microsystem Research Center,Chongqing University,Chongqing 400044,China);Measurement of deflection angle performance of 1D torsion micro mirror[J];Journal of Functional Materials and Devices;2008-02
China Proceedings of conference Full-text Database 3 Hits
1 LUO Jun,XIE Shaorong,HAO Shanbo,FENG Wei School of Mechatronics Engineering and Automation,Shanghai University,Shanghai 200072;Deformational Measurement of Elasticity Link of Asymmetrical Pitch System for Micro Air Vehicles[A];[C];2007
2 XIE Shaorong,LUO Jun,GONG Zhenbang,HAO Shanbo,FENG Wei School of Mechatronics Engineering and Automation,Shanghai University,Shanghai 200072;Dynamic Testing of a Novel Asymmetrical Pitch Using High Speed Image[A];[C];2007
3 Zhao Jiangming Shen Xuejin Zhang Yongyu Chen Xiaoyang Shanghai University, Shanghai, 200072;Experimental Study on Micro Electrostatic Resonator with One-side Straight-leg folded Suspensions[A];[C];2005
【Secondary Citations】
Chinese Journal Full-text Database 10 Hits
1 MEI Nian song,HUANG Qing an (Key Laboratory of MEMS of Education Ministry,Southeast University,Nanjing210096,China);A new structure for measuring MEMS films fracture strength——thermal actuator[J];Micronanoelectronic Technology;2003-Z1
2 LI Jin1,2,ZHENG Xiao-lin1,2,ZHANG Wen-xian1,CHEN Mo1(1.Open Laboratory on Biomechanics & Biorheology under the State Education Commission,Chongqing University,Chongqing 400044,China;2.Open Laboratory on Optical Technology & System under the State EducationCommission,Chongqing University,Chongqing 400044,China);Lasted development in the field of MEMS packaging[J];Micronanoelectronic Technology;2004-02
3 Rong Hua 1,Huang Qing'an 1,Nie Meng 2 and Li Weihua 1(1 Key Laboratory of MEMS of Education Ministry,Southeast University,Nanjing 210096,China) (2 School of Science,Hefei University of Technology,Hefei 230009,China);An Analytical Model for Pull-in Voltage of Doubly-Clamped Multi-Layer Beams[J];Chinese Journal of Semiconductors;2003-11
4 Mei Niansong and Huang Qing'an(Key Laboratory of MEMS of Education Ministry,Southeast University,Nanjing 210096,China);Modeling and Simulation of a Test Structure for Measuring Vertical Fracture Strength of MEMS Film[J];Chinese Journal of Semiconductors;2004-01
5 Xu Gaobin and Huang Qing'an.(Key Laboratory of MEMS of Education Ministry,Southeast University,Nanjing 210096,China);Design and Simulation of On-Line Test Structure for Thermal Conductivity of Polysilicon Thin Films[J];Chinese Journal of Semiconductors;2004-04
6 Rong Hua 1,Huang Qing'an 1,Nie Meng 2 and Li Weihua 1(1 Key Laboratory of MEMS of Ministry of Education,Southeast University,Nanjing 210096,China) (2 School of Science,Hefei University of Technology,Hefei 230009,China);A Novel Anchor for Microbeam with Perfect Fixed-End Boundary Conditions[J];Chinese Journal of Semiconductors;2004-06
7 Nie Meng 1,2,Huang Qing'an 1,Wang Jianhua 2,Rong Hua 1 and Li Weihua 1(1 Key Laboratory of MEMS of Education Ministry,Southeast University,Nanjing 210096,China) (2 School of Science,Hefei University of Technology,Hefei 230009,China);An Electrostatic Actuated Microelectromechanical In-Situ Extracting Method for Material Property of Multi-Layer Film[J];Chinese Journal of Semiconductors;2004-11
8 Zhang Yuxing,Huang Qing’an,and Li Weihua(Key Laboratory of MEMS of Ministry of Education,Southeast University,Nanjing 210096,China);A Novel Surface-Micromachined Structure For On-Line Measuring Thermal Expansion Coefficient of Polysilicon Thin Films[J];Chinese Journal of Semiconductors;2005-04
9 Nie Meng,Huang Qing’an,and Li Weihua(Key Laboratory of MEMS of Ministry of Education,Southeast University,Nanjing 210096,China);An In-Situ Extracting Method for Residual Stresses of a Multilayer Film by Full-Field Optical Measurement[J];Chinese Journal of Semiconductors;2005-05
10 Liu Zutao,Huang Qing’an,and Li Weihua(Key Laboratory of MEMS of Ministry of Education,Southeast University,Nanjing 210096,China);An Optimized Micro-Rotating Structure for Measuring Residual Strain of Thin Films[J];Chinese Journal of Semiconductors;2005-05
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