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《Journal of Vibration and Shock》 2001-03
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INFLUENCE OF BUMP LOAD ON PACKED PRODUCTS

Xu Wencai (Beijing Institute of Printing,Beijing 102600) Xiang Ming (Xi'an University of Technology,Xi'an 710048)  
After theoretical analysis and experimental tests it is believed that the continuous bump load during transportation can damage products,and it should be considered as a factor in transport package design.
【CateGory Index】: TB485
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