Full-Text Search:
Home|Journal Papers|About CNKI|User Service|FAQ|Contact Us|中文
《Journal of Vibration and Shock》 2017-16
Add to Favorite Get Latest Update

A study on the reliability of double-bump solder joints based on Patran and frequency domain analysis under random vibration load

ZHANG Long;HUANG Chunyue;HUANG Wei;HUA Jianwei;School of Electro-Mechanical Engineering,Guilin University of Electronic Technology;  
Based on Patran software,the 3D finite element models of double-bump solder joints were set up.The natural frequency,vibration mode and frequency response rule of the models were analyzed under random vibration.The stress and strain distribution and the response curves of strain power spectrum density for the double-bump solder joints were obtained,and then the random vibration fatigue life of the double-bump solder joints were also calculated out based on the power spectrum and rain flow count method.The effect of the pad diameter and the maximum radial diameter for double-bump solder joints on the fatigue life of the double-bump solder joints were analyzed under random vibration.The results obtained from the simulation show that the double-bump solder joint with the height of 0.5 mm,the pad diameter of0.3 mm and the maximum radial diameter of 0.4 mm has the fatigue life of 3 132 h under random vibration.When the pad diameter increases from 0.2 mm to 0.35 mm,the fatigue life of double-bump solder joints increases with the pad diameter.When the maximum radial diameter of solder joints increases from 0.4 mm to 0.55 mm,the fatigue life of double-bump solder joints decreases with the maximum radial diameter.
【Key Words】: random vibration double-bump solder joint power spectrum fatigue life finite element analysis
【Fund】: 国家自然科学基金资助项目(51465012);; 广西壮族自治区自然科学基金资助项目(2015GXNSFCA139006)
【CateGory Index】: TN405
Download(CAJ format) Download(PDF format)
CAJViewer7.0 supports all the CNKI file formats; AdobeReader only supports the PDF format.
©2006 Tsinghua Tongfang Knowledge Network Technology Co., Ltd.(Beijing)(TTKN) All rights reserved