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A New Thermal Probe Method for Determining Thermal Conductivity Based on the Minimal Dispersion of Thermal Diffusivity

CHEN Ze shao, LI Chuan, CHENG Wen long, HU Peng, QIU Xing hai (Department of Thermal Science and Energy Engineering, USTC, Hefei 230027, China)  
A new thermal probe method for the measurement of thermal conductivity has been presented based on error analysis and the principle that the dispersion of thermal diffusivity is certain to be a minimum if the error of thermal conductivity is a minimum. The method differs from the traditional method in that the thermal conductivity is not obtained directly from the formula of the model, but by finding the minimal dispersion of thermal diffusivity. It has been proved by theory and experiments that the method has very high accuracy because the errors of the subjectivity and the errors caused by that experiment not satisfied with the model can be obviated. The software for the data processing has been written and some kinds of liquids and powder materials have been measured by the method.
【CateGory Index】: O551
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