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《China Ceramic Industry》 2017-05
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Current Status and Development of Ceramic Metallization

QIN Diancheng;LI Baozhong;XIAO Yonglong;Rayben Technologies(Zhuhai) Ltd.Co.,Zhuhai 519180,Guangdong,China;Guangdong LED Packaing Heat Sink Substratae Engineering Technology Research Center;  
As a new heat dissipation material,ceramics with a high thermal conductivity has increasingly more advantages for application in high power electronic component packaging and dissipation.Ceramic metallization,the quality of which would directly influence the reliability and service life of electronic component is very important for power electronics packaging.This paper presents research status and development trend of metallization of ceramics as substrate heat dissipation materials with emphases on new metallization techniques and applications in other fields.
【CateGory Index】: TQ174.75
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