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《Chinese Journal of Rare Metals》 2014-01
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Microstructure and Bonding Strength of Hafnium and Copper Brazed Joints

Lu Xilong;Liu Ping;Liu Xinkuan;Chen Xiaohong;He Daihua;Ma Fengcang;School of Mechanical Engineering,University of Shanghai for Science and Technology;School of Materials Science and Engineering,University of Shanghai for Science and Technology;  
Hafnium and copper were brazed with 72Ag-28Cu filler metal in vacuum,the brazing temperature was 820 ~ 920 ℃,and the holding time was 1 ~ 45 min. The effects of brazing temperature and holding time on the microstructure and strength of the brazed joints were studied. The microstructure and morphology of the brazing joints were observed by scanning electron microscope( SEM),the chemical composition was analyzed by energy dispersive spectrometer( EDS),and the phases were determined by X-ray diffraction( XRD). The results showed that with the brazing temperature and holding time increasing,the shear strength of joints increased at first and decreased later. At 840 ℃,with 15 min holding time in vacuum,all kinds of phases distribution was uniform,and not coarsening yet,it had distribution advantages over the big and continuous phases which were obtained by raising the temperature and prolonging the holding time,and had a function of dispersion strengthening,and contributed to the release of stress,the shear strength was the highest at this time to achieve 201 MPa,indicating the formation of well bonded interface. The main reaction products of the brazing joints were Cu51Hf14,Cu8Hf3,but excessive Cu-Hf compounds were more sensitive to defects,easy to produce cracks and reduced the joints strength,and too few Cu-Hf compounds could lead to no good metallurgical bonding. Therefore,too high or too low temperature,too long or too short holding time were bad to the joint strength. The interfacial microstructure of the joint was Hf / Cu-Hf compound +Hf solid solution / Hf solid solution + Ag-Cu eutectic + Cu-Hf compound + Cu solid solution / Cu.
【Fund】: 国家自然科学基金项目(51201107);; 上海市教委科研创新项目(11YZ112);; 上海市科委基础重点项目(10JC1411800)资助
【CateGory Index】: TG454;TG407
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