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《The Chinese Journal of Nonferrous Metals》 2012-02
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Formation mechanism of intermetallic compounds and interface characteristics of joint of Sn-6.5Zn solder/Cu substrate

ZHAO Guo-ji,SHENG Guang-min,DENG Yong-qiang (College of Materials Science and Engineering,Chongqing University,Chongqing 400044,China)  
The interfacial reaction of Sn-Zn solder/Cu substrate soldered at 255 ℃ and the formation and transformation of intermetallic compounds(IMC) were investigated by the thermodynamic calculation and analysis.The interface of the joint produced at 255 ℃ with various soldering times was analyzed by scanning electron microscope(SEM),X-ray energy dispersive spectrometer(EDS) and X-ray diffraction(XRD).The results show that CuZn IMC forms preferentially within the Cu substrate.The Cu5Zn8 IMC forms by the reaction of CuZn with Zn atoms diffused from the solder.The effect of the soldering time on the interface thickness at the same soldering temperature is slight.With prolonging soldering time,the interface thickness between Sn-6.5Zn solder and Cu substrate increases,and the interface roughness reaches obviously a maximum value,and then decreases to a stable value,which is due to the non-uniform growth and dissolution of dendrite in liquid solder.
【Fund】: 重庆市自然科学基金资助项目(CSTC2007BB4111);; 重庆大学大型仪器设备开放基金资助项目(2010063010)
【CateGory Index】: TG454
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