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《The Chinese Journal of Nonferrous Metals》 2012-09
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Research progress of high aluminum-silicon alloys in electronic packaging

XIE Li-chuan,PENG Chao-qun,WANG Ri-chu,WANG Xiao-feng,CAI Zhi-yong,LIU Bing (School of Materials Science and Engineering,Central South University,Changsha 410083,China)  
Basic requirements of electronic packaging materials were reviewed,the characteristics and research situation of the high aluminum-silicon alloys were discussed,and the advantages and disadvantages of the preparation processes that include casting,infiltration,rapid solidification powder metallurgy and spray-forming were analyzed.Moreover,the development tendency of high aluminum-silicon alloy electronic packaging materials was pointed out.
【Fund】: 国家军品配套项目(JPPT-125-GH-039)
【CateGory Index】: TN04
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