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《Micronanoelectronic Technology》 2017-02
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Stability of the Abrasive in the Alkaline Slurry for the GLSI Copper Wiring

Zhao Yadong;Liu Yuling;Luan Xiaodong;Yan Chenqi;Wang Zhongjie;School of Electronic Information Engineering,Hebei University of Technology;Tianjin Key Laboratory of Electronic Materials and Devices;  
In the copper chemical mechanical polishing process,silica sol plays an important role as the abrasive for mechanical abrasion action.But the silica sol is thermodynamically unstable and kinetically stable.The effects of the pH value,glycine mass fraction and silica sol mass fraction on the particle size and Zeta potential for the silica sol in the slurry were studied.The results show that the silica sol is stable when the pH value is 10.5 and the system has the maximum Zeta potential.It is conducive to the stability of the silica sol with the glycine mass fraction less than2% and the silica sol mass fraction less than 5%.By DLVO theory and steric stabilization theory,the experimental phenomenon was analyzed and the silica sol stabilization mechanism was studied.Based on the stability conclusion,the slurry component was optimized to obtain the alkaline copper wiring slurry with the stable copper polishing rate,and the settling time of the slurry exceeded 14 days.
【Key Words】: chemical mechanical polishing(CMP) silica sol DLVO theory Zeta potential stability
【Fund】: 国家中长期科技发展规划重大专项资助项目(2009ZX02308);; 天津市自然科学基金资助项目(16JCYBJC16100);; 河北省自然科学基金资助项目(E2013202247)
【CateGory Index】: TN305.2
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