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《Journal of Beijing University of Chemical Technology(Natural Science Edition)》 2006-03
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Synthesis and curing of dicyclopentadiene-containing epoxy resin

YU Meng WANG-tao ZHANG Li-xin WAN Ping-yu(College of Science,Beijing University of Chemical Technology,Beijing 100029,China)  
Using phenol and dicyclopentadiene(DCPD) as raw materials,a DCPD-containing phenolic resin(DPR) was prepared via Friedel-Crafts alkylation and a DCPD-containing epoxy resin(DER) was prepared via epoxidation of DPR with epichlorohydrin.The reaction conditions and method were optimized.The epoxy value of DER was found to be 0.31~0.35 and the content of organic chloride less 0.02?mol/100?g.Curing was carried out using hexahydro-4-methylphthalic anhydride(MeHHPA) as curing agent and the rate of curing was evaluated by FT-IR.At a curing temperature of 180?℃,the yield of epoxy ring opening was more than 92% after (3.5?h.) DSC analysis showed that the T_g of cured epoxy resin DER+E51 (1∶1) is higher than that of epoxy resin E51 itself.
【Fund】: 北京化工大学青年教师基金(QN0307)
【CateGory Index】: TQ323.5
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