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Preferred orientations of Ag and Cu films on Ni substrate and valence electron analysis

ZHANG Xiao-jun1,ZHANG Jian-min2,WANG An-xiang1,ZHAI Xue-jun1 (1.School of Science,Xi'an Polytechnic University,Xi'an 710048,Shaanxi,China;2.College of Physics and Information Technology,Shaanxi Normal University,Xi'an 710062,Shaanxi,China)  
Aim In order to study the formation mechanism of the preferred orientations for thin films,Ag and Cu films deposited on Ni(100) substrate.Methods X-ray diffraction(XRD) was used,the average electron densities and relative electron-density differences(REDD) between Ni(100) and 33 planes of Ag or Cu crystal were calculated based on the method of Bond Length Difference(BLD) of the Empirical Electron Theory(EET) of solids and molecules.Results The results by X-ray diffraction(XRD) show that the preferred orientations of Ag and Cu films deposited on Ni(100) substrate were(111),(100) and(110) in order.the results of calculations show that the more smaller the relative electron-density differences between two lattice planes is,the more stronger the preferred orientations is.Conclusion The preferred orientations appeared in Ag and Cu films have been explained satisfactory from continuity of electron density across interface.
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