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《Packaging Journal》 2017-05
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Research Progress in Molybdenum-Copper Composites

SUN Aokui;CHEN Qingrou;LIU Yuejun;WANG Haijun;WANG Dezhi;School of Packaging and Materials Engineering,Hunan University of Technology;School of Materials Science and Engineering,Southwest University of Science and Technology;School of Materials Science and Engineering,Central South University;  
Mo–Cu composites are of special merits because of excellent physical,mechanical and electronic properties,such as high thermal and electrical conductivity,low and alterable thermal expansion coefficient,light weight,nonmagnetic,good high–temperature performance and fair plasticity. These properties rendered Mo–Cu composites widespread applications in electronic packing devices,heat sink materials,vacuum technology(electrical contact),aerospace field and so on. Domestic and international research status of Mo–Cu composites was systematically summarized such as spray drying process,electroless plating,mechanical alloying,sol-gel method,chemical coprecipitation and powder injection forming method,with the latest preparation methods and research approaches emphatically demonstrated based on their development of applications. The defects restricting its large-scale application were detected as well. The development trend and direction of high performance Mo–Cu composites were also prospected based on the limitations of existing researches in order to prepare the well performed Mo–Cu composites by utilizing simple and green approaches with low energy consumption.
【Fund】: 国家自然科学基金资助项目(51704108);; 湖南省重点实验室开放基金资助项目(FP201704)
【CateGory Index】: TB331
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