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《Chinese Journal of Sensors and Actuators》 2018-06
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The Single-Wafer Single-Side Silicon Bulk-Micromachined Thermal Flow Sensor

XUE Dan;WANG Jiachou;LI Xinxin;Shanghai Institute of Microsystem and Information Technology,Chinese Academy of Sciences;University of the Chinese Academy of Sciences;  
A novel thermal flow sensor is proposed and developed,which is fabricated only from the front side of( 111) silicon wafer through bulk-micromachining process. COMSOL Multiphysics software is employed to optimize some sensitive parameters,which gives a promise to isolating the generating heat from the silicon wafer totally and reduces the device thermal loss at utmost. Furthermore,being benefit from the MEMS Micro-openings Inter-etchSealing( MIS) process,the fabricated sensor chip size is as small as 0.7 mm×0.7 mm. The testing results show that the flow sensor achieves an ultrahigh normalized sensitivity of 107.88 m V/( m/s)/W with respect to heating power and gain for nitrogen gas flow. Furthermore,the response time of the sensor is 1.53 ms and the accuracy is ±4%.
【Fund】: 国家自然科学基金面上项目(61674160)
【CateGory Index】: TP212
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