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《Materials Review》 1997-01
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The Research Progress on Soldering Materials for Electronics Industry

The match assemble soldering in electronics industry is developing towards high precision,high density and high reliability,which puts more strict requirements on solder materials, This paper gives a comprehensive discussion on the research progress of solder,flux and soldering materials,points out the development trends that should be paid attention to,and offers some proposals and measures.
【CateGory Index】: TG422
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【References】
Chinese Journal Full-text Database 1 Hits
1 Du Changhua, Zhao Xiaoju, Chen Fang and Wen Hua (Metallurgical Research Institute of Sichuan Province,Chengdu 610081);The Development Proposals of New Material Industry of Nonferrous Metal in the 21th Century[J];Sichuan Nonferrous Metals;1999-01
【Citations】
Chinese Journal Full-text Database 1 Hits
1 ZHANG Qiyun; LIU Shuqi (Department of Chemistry, Peking University); LIU Dongqi; YING Liangehun (Belling Nonferrous Smeltery) (Manuscript received 4 October, 1983);EFFECT OF TRACE ADDITIVE ON ANTI-OXIDATION OF MOLTEN Sn-Pb EUTECTICS[J];Acta Metallurgica Sinica;1984-04
【Co-citations】
Chinese Journal Full-text Database 10 Hits
1 Lu Yougkui;Thermodynamics of Surface Corrosion of Solid Pure Lead、Tin and Thier Alloys[J];Journal of University of Science and Technology Beijing;1989-02
2 Lu Yougkui Department of Chemistry;Surface Corrosion Kinetics of the Solid Lead, Tin and Their Alloys[J];Journal of University of Science and Technology Beijing;1991-05
3 GAN Gui-sheng,DU Chang-hua,CHEN Fang,WANG Wei-sheng(College of Material Science and Engineering,Chongqing Institute of Technology,Chongqing 400050,China);Thermodynamic Analysis on the Oxidation Reaction of Familiar Elements in Melting Tin-Solder Alloy[J];Journal of Chongqing Institute of Technology;2006-08
4 HU Yong-fang,LI Xiao-xuan,YU Sheng-lin (Nanjing Research Institute of Electronics Technology,Nanjing 210013,China);Au eutectic solders welding technology and its application[J];Electric Welding Machine;2008-09
5 LI Guang-dong, HAO Hu, SHI Yao-wu, XIA Zhi-dong, LEI Yong-ping (School of Materials Science & Engineering, Beijing University of Technology, Beijing 100022, China);Effect of the microelements on the oxidation-resistance of Sn-0.7Cu lead-free solder[J];Electronic Components and Materials;2007-11
6 LI Guang-dong, SHI Yao-wu, XU Guang-chen, XIA Zhi-dong, LEI Yong-ping (School of Materials Science & Engineering, Beijing University of Technology, Beijing 100124, China);Effect of phosphorus on the performance of Sn-Cu lead-free solder[J];Electronic Components and Materials;2008-11
7 DENG Zhi-rong,QIAN Yi-yu(Harbin Institute of Technology,Harbin 150001,China);Effect of P on the Oxidation Resistance of Sn-0.7Cu Lead-free Solder[J];Electronics Process Technology;2006-04
8 ;Factors of Influencing Thermal Fatigue of Solder Joint in SMT and its Research Method[J];ELECTRO-MECHANICAL ENGINEERING;2000-01
9 LI Zhi(Nanjing Research Institute of Electronics Technology, Nanjing 210013,China);An Analysis of Microstrip Ferrite Isolator Assembling Process[J];Electro-mechanical Engineering;2003-04
10 LI Kun-lan (CEPREI, Guangzhou, 510610, China);Failure Modes and Failure Mechanisms of Several Electronic Components[J];Electronic Product Reliability and Environmental Testing;2000-06
【Secondary Citations】
Chinese Journal Full-text Database 1 Hits
1 ZHANG Qiyun; LIU Shuqi (Department of Chemistry, Peking University); LIU Dongqi; YING Liangehun (Belling Nonferrous Smeltery) (Manuscript received 4 October, 1983);EFFECT OF TRACE ADDITIVE ON ANTI-OXIDATION OF MOLTEN Sn-Pb EUTECTICS[J];Acta Metallurgica Sinica;1984-04
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