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《Materials Review》 2014-16
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Without Activation Formaldehyde Electroless Copper Plating in Graphite Plate Deep Hole and Slit

ZHAI Lili;LIU Xiujun;LI Tongqi;SUN Yangyang;School of Environment Science and Chemical Engineering,Tianjin Polytechnic University;National Key Laboratory of Advanced Functional Composite Materials,Aerospace Research Institute of Materials &Processing Technology;College of Chemical and Pharmaceutical Engineering,Hebei University of Science and Technology;  
Different sizes of slit were simulated by graphite plates,the effect factors of ultrasonic-assisted electroless copper plating in the silt were studied.The processes of the electroless copper plating without activation and sensitization were compared using sodium hypophosphite and formaldehyde as reductants.The morphology of the coatings was observed by SEM.The chemical composition and crystal structure of copper-coated slit were characterized by XRD.It has been found that for the special properties of the graphite plates,the slits were coated successfully by electroless copper plating method without activation using formaldehyde as reductant.The copper plating of the slit was affected by slit size and the placement direction in the baths.More than 500μm slit and through hole,which were not affected by the placement direction,all can get the better coating.The slit between 100-500μm and more than500μm blind hole were affected by the placement direction.The coating in the slit can be obtained under the upright,but not under the horizontal.
【Fund】: 国家重点实验室基金(9140C560109130C569199);; 国家自然科学基金(51102070)
【CateGory Index】: TB306
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