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《Materials Review》 2018-S1
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Curing Kinetics of High Temperature Curing Film by Non-isothermal DSC Method

XU Yi;HE Qiang;Civil Aviation Safety Engineering Institute,Civil Aviation Flight University of China;Aviation Engineering Institute,Civil Aviation Flight University of China;  
The thermal behavior and curing kinetics of the high temperature curing film(METLBOND 1515-4)were investigated by non-isothermal DSC method.The apparent activation energies of the curing reaction were calculated by Kissinger and Ozawa dynamic models,which were 90.2 kJ/mol,92.7 kJ/mol respectively.Crane model was used to calculate the curing reaction series,curing process of the kinetic equation was obtained.The results showed that only one reaction mechanism occurred,the reaction sequence of the adhesive film was 0.95.In addition,based on the obtained kinetic parameters and the characteristics of curing reaction,a method for predicting the curing time was proposed to determine the curing process,which provided a theoretical basis for the curing,performance testing and application of the epoxy film.
【Fund】: 中国民用航空飞行学院博士科研启动项目(BJ2016-01);中国民用航空飞行学院青年基金项目(Q2018-43);; 中央高校教育教学改革专项项目(E20170207)
【CateGory Index】: TQ430.1
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