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Study of Micro Hole,Hole Array and 3D Micro Cavity Machined By USM

An Chengming,Yin Guoqiang,Li Jianzhong,Yu Zuyuan(Dalian University of Technology,Dalian 116024,China)  
To machine micro features in hard and brittle materials,a micro ultrasonic machining(USM) is developed equipped with a wire electrical discharge grinding(WEDG) unit used to prepare micro tools.The relationship between the machining efficiency and the micro hole depth and the influence of abrasive size on the machining accuracy are studied experimentally.In this study of micro USM,the machining process is controlled by constant static load.The circular hole with 18μm in diameter and the square hole with 28×28 μm2 have been drilled in silicon successfully.The micro-hole array and a cross-shaped hole have also been generated by micro-USM,as well as 3D micro cavity by applying Uniform Wear Method.
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