New Trends in Power Semiconductor Packaging Technology
The SKiiP-power semiconductor packaging technology comprises a direct thermal pressure contact between DCB ceramic and the heatsink and therefore the copper baseplate is eliminated. This leads to an inherent advantage in reliability and junction temperature. Two new power module families take adrantage of this technology and extend the pressure contact idea to the auxiliary connectors, which are contacted by using a spring. The integration of intelligent components makes a complete power subsystem solution feasible in one case. The new modules utilize the current-carrying capabilities of the IGBT generation trench cell ICBT.