Full-Text Search:
Home|About CNKI|User Service|中文
Add to Favorite Get Latest Update

High Power IGBT Modules with Improved Mechanical Performance and Advanced 3.3kV IGBT3 Chip Technology

Th.Stolze J.Biermann R.Spanke M.Pfaffenlehner  
New designs in power electronics always demand for an increase in power density,improved reliability and simpler assembly.Enabling higher thermal and electrical chip utilization combined with higher robustness and module reliability paired with compatibility to existing designs have been the targets of the lastest module development presented in the following.This paper also reasearched cosmic rays and power cyclic test.
Download(CAJ format) Download(PDF format)
CAJViewer7.0 supports all the CNKI file formats; AdobeReader only supports the PDF format.
©CNKI All Rights Reserved