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《ELECTRONIC COMPONENTS $ MATERIALS》 2000-01
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Improvement of film bounding capacity by improving technology

QIN Yue li, GAO Nen wu, WU Yun hai (Southeast Research Institute of Electronic Equipment, Chengdu Sichuan 610036)  
In Chinese Thin film technology is important in HIC Film bounding capacity is one of the most important factors that influence HIC quality The factors that cause the film peeling are found through tests They are film structure, diffusion between metal phases, metal sputtering atmosphere, rinse, etc Optimized technology conditions are also found (5 refs )
【CateGory Index】: TN451
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