Full-Text Search:
Home|Journal Papers|About CNKI|User Service|FAQ|Contact Us|中文
《ELECTRONIC COMPONENTS $ MATERIALS》 1994-05
Add to Favorite Get Latest Update

New Progress in Chip Ceramic Capacitors Technique

Dai Fugui  
Progress in surface-mounting technique(SMT) and miniaturization of electronic equipment promotes enhancement of surface mountable component ratio in sum of ceramic capacitors and their sizes shrinkage.Facing main topics are enhancement of dielectric constant of ceramics, decrease of it's firing temperature.decrease of dielectric layer thickness and keeping reliable contact of electrodes. Improvement of capacitor performance requires ceramics materials to elevate their thermostability and reduction of production cost requires use of base metal electrodes. Recent progress and trends in these aspects at the world are described in this paper.
【CateGory Index】: TM534.1
Download(CAJ format) Download(PDF format)
CAJViewer7.0 supports all the CNKI file formats; AdobeReader only supports the PDF format.
【References】
Chinese Journal Full-text Database 5 Hits
1 JIANG Yu, CHEN Jia-zhao, LIU Ying, TU Min-jing(College of Materials Science &Engineering, Sichuan University, Chengdu 610065, China);Progress of multi-layer ceramic capacitor (MLC)[J];Journal of Functional Materials and Devices;2003-01
2 SU Yan-jie (College of Material Science and Chemical Engineering, China University of Geosciences,Wuhan,Hubei430074,China);The Summary on Anti-reduction BaTiO_3-based Dielectric Ceramics[J];Electrical Engineering Alloy;2005-01
3 Liu JianMin (Jingdezhen Ceramic Institute 333000);Discuss On Classification of Ceramic Materials for Capacitors[J];Jiangsu Ceramics;2001-01
4 Wu Guangzhou1 Li Bin2 Wang Hailong1 Zhang Rui1(1Dept.of Materials Engineering,Zhengzhou University,Zhengzhou 450002;2Henan Qualitification Station of Agricultural Machinery,Zhengzhou 450003);Development of Ceramic Grain Boundary Capactor[J];Advanced Ceramics;2005-01
5 CUI Yong-zhen,HUANG Xin-you,GAO Chun-hua,WEI Min-xian (School of Materials Science and Engineering,Jiangsu University,Zhenjiang 212013,China);Effects of Bi_4Ti_3O_(12) Doping on Properties and Structureof BST Ceramics[J];Piezoelectrics & Acoustooptics;2009-02
【Co-references】
Chinese Journal Full-text Database 10 Hits
1 Wu Jian hui,Zhang Zhuan fu,Wu Lin lin ,Zhan Jing (Deparment of Metallurgy Science and Engineering, Central South University,Changsha,Hunan 410083,China);Precipitation Oxalate Method and Its Application in Preparing Powder Materials[J];Sichuan Nonferrous Metals;2001-03
2 WU Zhengcui, SHAO Mingwang, ZHANG Wenmin, SUN Yimin (College of Chemistry and Materials Science,Anhui Normal University, Wuhu 241000, China);THE PREPARATION OF CUPROUS OXIDE ULTRAFINE UNIFORM PARTICLES UNDER MICROWAVE IRRADIATION[J];Journal of Anhui Normal University(Natural Science);2001-04
3 WU Hong, SHI Hong - gang, FENG Hong - wei, FAN Ai - guo (1. Materials Science and Engineering Institute , Xi'an Jiaotong University , Xi'an 710049, China; 2. Ningbo Branch of China Academy of Ordnance Sciences, Ningbo 315103, China );Research progress in microwave sintering technology[J];Ordnance Material Science and Engineering;2004-04
4 ZHANG Kai-liang 1 ,LIU Yu-ling 1 ,WANG Fang 2(1.Institute of Microelectronic Technology&Materials,Hebei University of Technology,Tianjin300130,China;2.Department of Photoelectronics,Tianjin University of Technology,Tianjin300191,China);Development of semiconductor device and research of solid nanoelectron device[J];Semiconductor Information;2003-01
5 Li Huiqil;Zhong Guofang;Lu Fanxiu;Yang(Department of Materials Science and Engineering USTB,Beijing 100083.PRC);Arc Action in Passage of DC PJ-CVD Plasma Torch[J];JOURNAL OF UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING;1994-06
6 XU Yi, TENG Yi,XU Ming xi (Environ. & Chem. & Chem. Eng. College, Chongqing Univ. 400044,China) [;Study on Silane Agents and its New Application for Metal Surface Treatment[J];Surface Technology;2001-03
7 LIAO Rong 1, SUN Bo 2, TAN Hong bin 1 (1.Chemistry & Environmental Protection Engineering College, Southwest University for Nationalities, Chengdu, China; 2.College of Information Engineering, Chengdu University of Technology, China);RESEARCH OF PREPARATION OF ULTRAFINE COPPER POWDER USING FORMALDEHYDE AS REDUCTIVE AGENT[J];Journal of Chengdu University of Technology(Science & Technology Edition);2003-04
8 ZHU Junwu, CHEN Haiqun, XIE Bo, YANG Xujie, LU Lude, WANG Xin *(Materials Chemistry Laboratory, Nanjing University of Science and Technology, Nanjing 210094, Jiangsu, China);Preparation of Nanocrystalline Cu_2O and Its Catalytic Performance for Thermal Decomposition of Ammonium Perchlorate[J];Chinese Journal of Catalysis;2004-08
9 ;Several Issues on Preparation Technology of Ultrafine Metallic Powders[J];Materials Review;1997-01
10 ;The Summary of Nanocrystalline Materials[J];Materials Review;1997-02
【Secondary References】
Chinese Journal Full-text Database 10 Hits
1 HU Minyi,ZHOU Kanggen,WANG Chongguo,XU Rui(School of Metallurgical Science and Engineering,Central South University,Changsha 410083);Progress in Research on Preparation and Surface Modification ofCopper Powder for MLCC Electrode[J];Materials Review;2006-12
2 Jiang Yu, Liu Ming,Yang Yanmin, Guan Denggao, Chen Jiazhao, Tu Minjing (Sichuan University, Chengdu 610065, China);The Hydrogen Mechanism Study in Preparing Nanonickel by Plasma Arc Spraying Method[J];Rare Metal Materials and Engineering;2005-03
3 JIANG Yu1, LAI Qing-gui2, YANG Yan-ming1, GUAN Deng-gao1, CHEN Jia-zhao1, TU Ming-jing1 (1. Metal Department, College of Materials Science & Engineering, Sichuan University, Chengdu 610065, China; 2. Hongming Electronics Co., Ltd., Chengdu 610058, China);Preparation of Nano Nickel Powder for MLCs by Non-confined Arc with Fusible Hydrogen[J];Electronic Components $ Materials;2003-12
4 JIANG Yu1, LAI Qing-gui2,YANG Yan-ming1, GUAN Deng-gao1, CHEN Jia-zhao1, TU Ming-jing1 (1. Metal Material Department, Sichuan University, Chengdu 610065, China; 2. Hongming Electronics Co., Ltd., Chendu 610058, China);Factors Influencing Productivity in Preparing Nanometer-sized Nickel[J];Electronic Components $ Materials;2004-01
5 ZHUANG Li-bo1,BAO Sheng-xiang1,WANG Rong2(1.University of Electronic Science and Technology,Chengdu 610054;2.Chengdu Hongming UESTC New Material Co.Ltd.,Chengdu 610058,China);Research of Silver Termination Electrode Paste for MLCC[J];Electronics Process Technology;2009-04
6 Hu Minyi,Wang Chongguo,Zhou Kanggen (College of Metallurgical Science and Engineering,Central South University,Changsha 410083);Study on preparation process of ultrafine copper powders for MLCC electrode[J];Powder Metallurgy Technology;2007-06
7 WANG Chong-guo,ZHOU Kang-gen,HU Min-yi (College of Metallurgical Science and Engineering,Central South University,Changsha 410083,China);Study on preparation and morphology of superfine copper powders for MLCC electrode[J];Materials Research and Application;2007-02
8 OU Yu-zhi,ZHOU Da-li,WU Xiao-xia,YANG Wei-zhong,CAI Xiao-xian,XIONG Ren-jin (College of Materials Science and Engineering, Sichuan University, Chengdu 610064, China);Preparation of Nanometer Composite Additive Powder for Multilayer Ceramic Capacitor[J];Bulletin of the Chinese Ceramic Society;2008-02
9 HUANG Xinyou, HUANG Guojun, CHEN Zhigang, PAN Li, GAO Chunhua, CHEN Xiangchong (School of Materials Science and Engineering ,Jiangsu University, Zhenjiang 212013, Jiangsu, China);PREPARATION OF SrTiO_3 NANOMETER POWDER USED FOR MULTILAYER CERAMIC CAPACITOR[J];Journal of the Chinese Ceramic Society;2006-05
10 HUANG Xinyou,CHEN Zhigang,HUANG Guojun,CHEN Xiangchong,GAO Chunhua (School of Materials Science and Engineering ,Jiangsu University, Zhenjiang 212013, Jiangsu, China);PREPARATION OF NANOMETER POWDER OF (Ba, Sr, Cd)TiO_3 FOR MULTILAYER CERAMIC CAPACITOR[J];Journal of the Chinese Ceramic Society;2007-04
©2006 Tsinghua Tongfang Knowledge Network Technology Co., Ltd.(Beijing)(TTKN) All rights reserved