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Study on Encapsulation Technology of Electronic Products Relay Installation

WANG Zhuo-ru;ZHANG Yun;CHEN Yu-bao;Beijing Aerospace Wanyuan Science& Technology Corporation;  
The relays product failure caused by the vibration is particularly prominent. To improve electronic product with relays in the reliability of environmental testing, especially the ability to resist vibration, research the relay installation process in use of PCB encapsulation process. By comparing the material parameter and test result, selected three kinds of encapsulation materials for process study. The environmental test proved that the encapsulation process on this product is a kind of effective means to enhance the reliability of products. Three materials can improve product vibration resistance. In the end, by comparing the response of the encapsulated relays under height level vibration test, get more effective encapsulation material.
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