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《Electronic Technology》 2017-06
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Effect of runner section structure of a power amplifier module on heat dissipation performance

Peng Wei;Liu Wanjun;Cui Zhenzhen;Yang Liubin;No.38 Research Institute of CETC;  
In order to further study the performance of liquid cooling heat dissipation effect of channel section structure of the transmitter cabinet power module, the simulation platform is built by means of engineering thermal power module and reliable numerical model, characteristic curve from the channel section area and the ratio of height to width of the two dimensions of a detailed analysis of internal components of power tube flange temperature, optimization parameters of channel section reasonable structure design obtained, provides an effective reference for the future similar channel thermal design components.
【CateGory Index】: TN830
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【Citations】
Chinese Journal Full-text Database 6 Hits
1 ZHANG Lei-ming;Shanghai Jiao Tong University,School of Aeronautics and Astronautics;Luoyang Optoelectro Technology Development Center,Communications and Technology Institute;;Thermal Design of the Telemetry Transmitter on Flotherm[J];装备制造技术;2014-01
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3 Liu Hongbing,Xu Yang(The 13th Research Institute,CETC,Shijiazhuang 050051,China);Analyze on Thermal Failure of Microwave Power Transistor[J];半导体技术;2008-09
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6 FU Gui-cui, GAO Ze-xi (Beijing University of Aeronautics and Astronautics, Dept.of Systems Engineering, Beijing 100083, China);Analysis of Geometric Factors on Effect Upon the Capability of Heat Sink of Power Component[J];电子器件;2003-04
【Co-citations】
Chinese Journal Full-text Database 8 Hits
1 Peng Wei;Liu Wanjun;Cui Zhenzhen;Yang Liubin;No.38 Research Institute of CETC;;Effect of runner section structure of a power amplifier module on heat dissipation performance[J];电子技术;2017-06
2 CAO Feng-peng;Xiamen Electronic Technology Co.,Ltd.;;Integrated Structure Design of A Power Amplifier Based on Thermal Design[J];企业技术开发;2017-02
3 HUANG Yong;LIU Zhengshan;GUO Liang;WEI Wei;Changchun Institute of Optics,Fine Mechanics and Physics,Chinese Academy of Sciences;Institute of Telecommunication Satellite,China Academy of Space Technology;;Study on Methods of Variable High Power Device Heat Dissipation for GEO Communications Satellite[J];航天器工程;2017-01
4 HU Zixiang;WANG Zhihai;DENG Youyin;LI Cong;No.38 Research Institute of CETC;National Industrial Design Center(CETC38);;Simulation Analysis and Optimization of Pin Failure of a Radar Microwave Power Transistor[J];机械与电子;2017-01
5 LI Genbao;WANG Xi;WANG Yang;SHI Xiao;School of Automobile,Chang'an University;;Experiment Evaluation of the Operating Thermal Load of an Intelligent Traffic Camera[J];电子器件;2016-06
6 Qu Xinghong;Zhao Zilong;Yu Bin;Liu Yang;NARI Technology Development Co., Ltd;;Study on Power Unit Design and DC Busbar Current Carrying Demand for Grid-connected Converter[J];电气技术;2016-12
7 TANG Xiaoying;Nanjing Research Institute of Electronics Technology;;Development and Application of Microsystem Technology[J];现代雷达;2016-12
8 LIU Fen-fen;YIN Ben-hao;Southwest China Research Institute of Electronic Equipment;;Application Progress of Carbon Nanotubes in Thermal Management[J];电子机械工程;2016-06
【Secondary Citations】
Chinese Journal Full-text Database 1 Hits
1 FANG Xun-leiJIANG Wei-zhuoYAN Wei (Nanjing Research Institute of Electronics TechnologyNanjing 210013);Application of Infrared Thermography Technology to Microwave Multichip Module[J];现代雷达;2004-01
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