Full-Text Search:
Home|Journal Papers|About CNKI|User Service|FAQ|Contact Us|中文
《Electronic Technology》 2017-07
Add to Favorite Get Latest Update

Research on Improved the Welding Reliability of Wire Wound Inductors

Zhong jinggao;Wang shangheng;Wang dong;SHENZHEN ZHENHUA FU ELECTRONICS CO.,LTD.;  
The risk of resistance spot welding joints falling off when the wire wound Inductors subjected to external forces, through deeply studied and analyzed about the failure mechanism of joints abscission know that due to lack of welding strengh. When optimized the based design and changed the welding process, solved the indutors welding defect so that improved the welding reliability of wire wound Inductors.
【CateGory Index】: TM55
Download(CAJ format) Download(PDF format)
CAJViewer7.0 supports all the CNKI file formats; AdobeReader only supports the PDF format.
【Citations】
Chinese Journal Full-text Database 3 Hits
1 CHEN Li-mei;HUANG Yi-gong;ZHANG Ju-xian;Beijing Vacuum Electronics Research Institute;Vacuum Electronics National Laborarory;;Research on Metallization Process for High-Purity and Fine-Gained Al_2O_3 Ceramics[J];真空电子技术;2014-05
2 WANG Jian;LI Yuan-bo;YU Zhao-qin;GUO Zhong-ning;College of Mechanical and Electrical Engineering,Guangdong University of Technology;;Effects of welding current on quality of spot welding joints of enameled wire to copper foil[J];电焊机;2014-04
3 ZHANG Zhen-xia,LI Xiu-xia,and ZHAO Song(Institute of Electronics,Chinese Academy of Science,Beijing 100190,China);Typical Applications of Au-Based Solder Its Possible Substitute[J];真空电子技术;2009-04
【Co-citations】
Chinese Journal Full-text Database 6 Hits
1 Zhong jinggao;Wang shangheng;Wang dong;SHENZHEN ZHENHUA FU ELECTRONICS CO.,LTD.;;Research on Improved the Welding Reliability of Wire Wound Inductors[J];电子技术;2017-07
2 GUO Feifei;CHEN Xiaoyu;SHI Xiumei;QI Yuefeng;ZHANG Guoqing;HUANG Xiaomeng;QI Yu;Beijing Non-ferrous Metals and Rare Earth Research Institute;Beijing Engineering Research Center of New Brazing Materials for Electronic Information;;Effect of Pd content on microstructure and properties of Ag-Cu-Pd solder[J];有色金属科学与工程;2017-03
3 LI Shaozhe;LI Yuanbo;ZHOU Leilei;GUO Zhongning;College of Mechanical and Electrical Engineering,Guangdong University of Technology;;Analysis of indirect spot welding process test of enameled wire and copper foil[J];电焊机;2015-04
4 SONG Haidong;BAO Yefeng;REN Qiang;Hohai University;;Study on structure and property of electronic device pin's joints by capacitor discharge welding[J];电焊机;2015-03
5 Zhang Tao;Chen Ming;Liu Shuqin;Zhang Cheng;Dong Tingyi;Sun Xiulin;Grikin Advanced Materials Co. ,Ltd. ,General Research Institute for Nonferrous Metals;;Solid Phase Transition of Cold-Rolling Au-44%Cu Alloy[J];稀有金属;2014-06
6 Hu Jie-Qiong;Xie Ming;Zhang Ji-Ming;Liu Man-Men;Yang You-Cai;Chen Yong-Tai;State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Kunming Institute of Precious Metals;;First principles study of Au-Sn intermetallic compounds[J];物理学报;2013-24
【Secondary Citations】
Chinese Journal Full-text Database 7 Hits
1 ZHANG Ju-xian;Beijing Vacuum Electronics Research Institute,Vacuum Electronics National Laboratory;;Review on Application Properties of Low Dielectric Loss and Fine Grained Al_2O_3 Ceramics[J];真空电子技术;2013-04
2 ZHANG Ju-xian1,2,SHI Ming1,SHANG A-man1 (1.Beijing Vacuum Electronics Research Institute,Beijing 100015,China; 2.Vacuum Electronics National Laboratory,Beijing 100015,China);Investigation in Metallizing Mechanism of High Pure and Fine Grained Al_2O_3 Ceramic by Molybdenum-Manganese Process[J];真空电子技术;2011-04
3 ZHANG Shu-hao,CAO Biao(College of Mechanical and Automotive Engineering,South China University of Technology,Guangzhou 510640,China);One-side welding enameled wire to copper foil with spot welding inverter[J];电焊机;2010-09
4 LI Yuan-bo1,YANG Shi-tong2,GUO Zhong-ning1(1.Guangdong University of Technology,Guangzhou 510006,China;2.Guangzhou Micro Welding Equipment Co.,Ltd,Guangzhou 510385,China);Precise Soft-switching Resistance Spot Welding Inverter Based on SOC[J];电力电子技术;2010-02
5 MO Binghua,GUO Zhongning (Faculty of Electromechanical Engineering,Guangdong University of Technology,Guangzhou 510006);Review of Resistance Microwelding Technology[J];材料导报;2009-23
6 LIU Cheng-yu,WANG Xiao-chuan,ZHAO Jian-hua(College of Mechanical Engineering,Chongqing University,Chongqing 400044,China);Technology of minisize piece spot welding[J];电焊机;2007-05
7 WANG Gong nian,GAO Long qiao(Beijing Vacuum Electronics Research Institute Beijing,Beijing 100016,China);Application of the Brazing Materials for Electronic Devices[J];真空电子技术;2001-02
©2006 Tsinghua Tongfang Knowledge Network Technology Co., Ltd.(Beijing)(TTKN) All rights reserved