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Preparing Phenol-formaldehyde Resin Adhesive from Waste Printed Circuit Boards

CHEN Lie-qiang,HU Ya-lin,ZHOU Wen-xian (Key Laboratory of Enhanced Heat Transfer and Energy Conservation of Ministry of Education,School of Chemistry and Chemical Engineering,South China University of Technology,Guangzhou 510640,China)  
Phenol-formaldehyde resin adhesive was prepared by reaction of formaldehyde and pyrolytic oil instead of pure phenol. An orthogonal experiment was performed to investigate the impact of factors such as amount of formaldehyde,amount of catalyst and temperature of the first stage and second stage on bond strength. According to results of orthogonal test and whole performance of phenol-formaldehyde resin adhesive,a reasonable synthetic process was proposed with pyrolytic oil 35g,37wt% formaldehyde 47g,40wt% catalyst 7.8g,temperature of the first stage and second stage 60℃ and 90℃. Product performances meet the qualification of phenol-formaldehyde resin for the laminates in GB/T14732-2006. The products were characterized by FTIR and HPLC to study mechanism of its reaction. The synthetic adhesive has a good prospect with low cost when using pyrolytic oil instead of pure phenol.
【Fund】: 广东省科技计划项目(2006A36703001)
【CateGory Index】: TQ433.431
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