Full-Text Search:
Home|Journal Papers|About CNKI|User Service|FAQ|Contact Us|中文
《Powder Metallurgy Technology》 2007-01
Add to Favorite Get Latest Update

Effect of mechanical alloying on the property of Mo-Cu alloy

Zhou Xianliang, Rao Youhai, Hua Xiaozhen, Zhang Jianyun, Zou Aihua (Department of Material Engineering, Nanchang Institute of Aeronautical Technology, Nanchang 330034,China)  
The effect of mechanical alloying on the property of Mo-Cu alloy for electronic packaging was studied. It is found that the molybdenum and copper powder particles get totally out of shape and become flaky after mechanical alloying, the tiny particles are obviously increased in number and stuck on the big particles. Tiny particle size is in the range of nanometer. The diffraction peaks of the molybdenum and copper after the mechanical alloying become wider and the intensity of diffraction peaks drop. After the mechanical alloying, the density, hardness, electric and thermal conductance of the Mo-30Cu alloy sintered at different temperature are comparatively higher than that of mixed one. The density, hardness, electric and thermal conductance of the Mo-30Cu alloy increase with the temperature increased until 1 250℃.
【Fund】: 江西省教育厅科技项目资助(赣教字166号)
【CateGory Index】: TG113.25
Download(CAJ format) Download(PDF format)
CAJViewer7.0 supports all the CNKI file formats; AdobeReader only supports the PDF format.
【References】
Chinese Journal Full-text Database 5 Hits
1 GUO Shi-bo,KANG Qi-ping,CAI Chun-bo(College of Electromechanical Engineering,Hunan University of Science and Technology,Xiangtan 411201,China);Effects of Activating Element Co on Microstructure and Properties of Mo-Cu Alloy[J];Journal of Materials Science and Engineering;2011-01
2 Han Shengli,Song Yueqing,Cui Shun(Powder Metallurgy and Special Materials Research Department,General Research Institute for Nonferrous Metals,Beijing 100088,China);The investigation on flaws of Mo-Cu alloys[J];Powder Metallurgy Technology;2009-02
3 KANG Qi-ping,GUO Shi-bo(1.College of Electromechanical Engineering,Hu′nan University of Science and Technology,Xiangtan 411201,China);Effects of Milling Time and Sintering Temperature on Properties of Mo-Cu Alloy Prepared by Sintering[J];Materials for Mechanical Engineering;2010-10
4 LI Liaohuan1,2,WANG Dezhi1,2,DONG Xiaojia1,2,DUAN Baihua1,2(1.School of Material Science and Engineering,Central South University,Changsha 410083,China;2.Key Laboratory of NonferrousMetalMaterialScienceandEngineering,Ministryof Education,CentralSouthUniversity,Changsha410083,China);Preparation and Sintering of Mo-Cu Ultrafine Composite Powder[J];Hot Working Technology;2013-06
5 WANG De-zhi1,2,WANG Guang-jun1,2,ZHOU Jie1,2,WU Zhuang-zhi1,2(1.Key Laboratory of Nonferrous Metal Materials Science and Engineering,Ministry of Education,Central South University,Changsha 410083,China;2.School of Materials Science and Engineering,Central South University,Changsha 410083,China);Preparation of Mo/Cu composite powders with ultrasonic electroless plating copper[J];Journal of Central South University(Science and Technology);2008-05
【Citations】
Chinese Journal Full-text Database 2 Hits
1 ;Relations Between Composites and Environment and Composites with Environmental Consciousness[J];Materials Review;1997-05
2 NAN Hai~1,QU Xuanchui~1,FANG Yu-cheng~2,HE Xin-bo~1 (1.Powder Metallurgy Research Institute,University of Science and Technology Beijing, Beijing 100083,China;2.Central Iron and steal Research Institute,Beijing 100081,China);POWER INJECTION MOLDING OF Mo/Cu ALLOY FOR ELECTRONIC PACKAGING[J];Powder Metallurgy Industry;2004-06
【Co-citations】
Chinese Journal Full-text Database 10 Hits
1 Wu Renjie ( Institute of Composite Materials, Shanghai Jiaotong University 200030);DEVELOPING TREND OF COMPOSITE MATERIALS NEXT CENTURY[J];Engineering Plastics Application;1999-02
2 LIU Chang-ling1,WANG Xiao-bo1,WU Shi-biao2,XU Ling2(1.Department of is Chemistry,Hefei Teachers College,Hefei 230061,China;2.Anhui Institute of Architecture and Industry,Hefei 230022,China);Study on the Photocatalytic Activity of the Fe~(3+)-doped TiO_2 Nanometer Powders in the Sunlight[J];Journal of Hefei Teachers College;2008-03
3 LIU Chen-shu1,LIU Chang-ling2(1.School of Life Science,University of Science and Technology of China,Hefei 230027,China;2.Department of Chemistry and Chemical Engineering Hefei Teachers College,Hefei 230061,China);The Effect of Preparation Technology of Nano-powders of Iron-doped TiO_2 on Photo-catalytic Activity[J];Journal of Hefei Teachers College;2009-03
4 JING Yu-an1,WANG Chen-yu2(School of Materials Science and Engineering,University of Science and Technology Liaoning,Anshan 114051,China;2.Anshan High & Advanced Technology Development Zone,Anshan 114044,China);Manufacturing technology for clad plate of stainless steel[J];Journal of Anshan University of Science and Technology;2007-06
5 He Yanlin,Li Jianpin;IMPACT FRACTURE BEHAVIOR OF SIC_p/A359 COMPOSITES[J];ORDNANCE MATERIAL SCIENCE AND ENGINEERING;1999-06
6 Liu Zhengchun, Wang Zhifa, Jiang Guosheng;ADVANCES IN METAL-MATRIX MATERIAL FOR ELECTRONIC PACKAGING[J];Ordnance Material Science and Engineering;2001-02
7 YIN Hong-feng ZHANG Zi-ying TIAN Yang-li YUAN Zhi-li School of Materials Science and Engineering,Xi'an University of Architecture & Technology,Xi'an 710055,China;Fabrication and properties of in-situ mullite rodlike crystal reinforced BAS composite[J];Ordnance Material Science and Engineering;2008-02
8 SUI Puhui,LU Lei,ZHANG Cuiling(College of Materials Science and Engineering,Nanjing University of Technology,Nanjing 210009,China);Research on heat treatment process of Li_2O-ZnO-Al_2O_3-SiO_2 glass-ceramics by orthogonal testing method[J];Ordnance Material Science and Engineering;2009-03
9 Ma Jiafeng1,Liu Xinyu1,2,Yuan Changlai1,2,Liu Chaoying1(1.Guangxi Key Laboratory of Information Material,Guilin University of Electronic Technology,Guilin 541004,China;2.School of Materials Science and Engineering,Central South University,Changsha 410083,China);Influence of Mn Doping on the NTC Characteristics of SrBiFeO Ceramics[J];Micronanoelectronic Technology;2010-06
10 CHEN Jin?fang (Jiangsu University of Science and Technology,Jiangsu Prov. Zhenjiang 212013,China);Thermodynamics Computing of Molybdenum Electrode Reaction with Glass Component[J];GLASS & ENAMEL;1999-06
China Proceedings of conference Full-text Database 9 Hits
1 Jiang Longtao,Chen Guoqin,Xiu Ziyang,Zhang Qiang,Sun Xingguo,Wu Gaohui (Department of Materials Science and Technology,Harbin Institute of Technology,Harbin 150001);Effect of Mg Content on the Aging Behavior of Submicron Al_2O_(3P)/Al-Cu-Mg Composites[A];[C];2006
2 ZHENG Liancong,YE Zhengmao,CHENG Xin(School of Materials Science and Engineering,University of Jinan,Jinan 250022,China);RESISTANCE TO SULFATE ATTACK OF SULPHOALUMINATE CEMENT[A];[C];2009
3 Hu Fei Chen Yuanxiang Xiao Wei (School of Materials Science and Engineering,Jingdezhen Ceramic Institute,Jingdezhen 33301);PREPARATION OF Cu_2O THIN FILMS USING SUCCESSIVE IONIC LAYER ADSORPTION AND REACTION(SILAR) METHOD[A];[C];2010
4 QIU Shu-heng HE Qian NIU Cun-tao CUI Xue-min (School of Chemistry and Chemical Engineering,Guangxi University,Nanning 530004,China);Preparation and study of a low softening temperature inorganic adhesive[A];[C];2007
5 Tong Linsong Fan Jianzhong Xiao Bolu (National Engineering & Technology Research Center for Non-ferrous Metals Composites,General Research Institute for Non-ferrous Metals Beijing 100088,China);The Research Progress of Low Thermal Expansion Aluminum Matrix Composites[A];[C];2007
6 Xu Huibing,Zhuang Weidong~*,Hu Yunsheng,Xia Tian,Wen Xiaofan,Liu Ronghui(General Research Institute for Nonferrous Metals,National Engineering Research Center for Rare Earth Materials,and Grirem Advanced Materials Co.Ltd., Beijing 100088,China);Influence of Alkaline Metal Ions Doping on Properties of(Y,Gd)BO_3:Tb[A];[C];2010
7 LIU Xiang-zhi,XU Ming-xia,LI Shun,ZHANG Nian-xing (School of Materials Science and Engineering,Key Laboratory for Advanced Ceramics and Machining Technology of Ministry of Education,Tianjin University 300072,China);The preparation of transition-metal ion doped titania nanowires and the visible photocatalytic activity[A];[C];2007
8 LI Cheng (Changzhou Tianma Group Co.Ltd,Changzhou 213002);CURRENT RESEARCH ON ECOMATERIALS AND THEIR DEVELOPMENT[A];[C];2008
9 BI Yu,WANG Ri-chu,LI Wen-xian,TAN Dun-qiang (College of Materials Science and Technology,Center South University,Changsha 410083,China);The Present Study of SiC/Al Metal Matrix Composites[A];[C];2003
【Co-references】
Chinese Journal Full-text Database 10 Hits
1 Liu Zhengchun, Wang Zhifa, Jiang Guosheng;ADVANCES IN METAL-MATRIX MATERIAL FOR ELECTRONIC PACKAGING[J];Ordnance Material Science and Engineering;2001-02
2 LI Zai-yuan,ZHAI Yu-chun,TIAN Yan-wen,WANG Tian-ran (School of Material and Metallurgy,Northeastern University,Shenyang110004,China);Research on preparation of Cu/Mo compound powder by hydro gen reducing Cu/Mo compound[J];Semiconductor Information;2003-04
3 Tian Minbo,Liang Tongxiang,He Wei (Department of Materials Science and Engineering,Qinghua University,Beijing, 100084);Electronic Packaging Technologies and Materials[J];SEMICONDUCTOR INFORMATION;1995-04
4 YANG Ziq in, JIA Chengchang, GANLe, ZHAO Jun, ME Zizhang Materials Science and Engineering School, UST Beijing, Beijing, 100083,China;Microstructures of W-Cu Alloys Prepared by Mechanical Activation Processes[J];Journal of University of Science and Technology Beijing;2002-02
5 Li Xiaohong;Xie Zizhang;Yang Rang(Department of Material Science and Engineering,USTB,Beijing 100083,PRC);Liquid Phase Sintered Molybdenum-Rich Copper Alloy[J];JOURNAL OF UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING;1996-04
6 GAO Shu-xuan,LIU Gui-chang,ZHANG Ru-zhi,CHEN Ye (School of Chemical Engineering,Dalian University of Technology,Dalian 116012,China);Development of Electroless Plating in Ultrasonic Field[J];Surface Technology;2004-02
7 ;Development of Powder Extrusion Molding[J];Materials Review;1997-06
8 Huang Qiang Gu Mingyuan Jin Yanping(State Key Lab. of Metal Matrix Composite, Shanghai Jiaotong University .Shanghai 200030 China);Current Status of Research on Electronic Packaging Materials[J];Materials Review;2000-09
9 CHEN Wenge WANG Chun (School of Materials Science and Engineering,Xi'an University of Technology,Xi'an 710048);Advances in Copper-matrix Material for Leadframe and Electronic Packaging of Integrated Circuitry (IC)[J];Materials Review;2002-07
10 HUANG Qiang JIN Yanping GU Mingyuan (State Key Lab, of Metal Matrix Composites,Shanghai Jlaotong University ,Shanghai 200030);Processing Routes of Metal Matrix Composite for Electronic Packaging[J];Materials Review;2002-09
China Proceedings of conference Full-text Database 1 Hits
1 LI Zeng-feng LIU Hai-yan TANG Hui-ping HUANG Yuan-ping ZHANG Han-liang LI Cheng TAN Ping HUANG Yu (Northwest Institute for Non-ferrous Metal Research,PM Center,Xi'an 710016,China);Effect of various factors on the thermal and electric conductivity of Mo-Cu alloy[A];[C];2007
【Secondary References】
Chinese Journal Full-text Database 7 Hits
1 GUO Shi-bo,KANG Qi-ping,CAI Chun-bo(College of Electromechanical Engineering,Hunan University of Science and Technology,Xiangtan 411201,China);Effects of Activating Element Co on Microstructure and Properties of Mo-Cu Alloy[J];Journal of Materials Science and Engineering;2011-01
2 Sun Aokui,Wang Dezhi,Li Yi(Central South University,Changsha 410083,China);Mechanochemical Synthesis of Mo-Cu Nanocomposites Powders at Low Temperature[J];Rare Metal Materials and Engineering;2012-04
3 LIANG Ping School of Mechanical Engineering,Liaoning Shihua University,Fushun 113001,China;Research status of ultrasonic electroless deposition[J];Electroplating & Finishing;2010-03
4 GUO Shi-bo,KANG Qi-ping (College of Electromechanical Engineering,Hunan University of Science and Technology,Xiangtan 411201,Hunan,China);Research on Preparation of Mo-Cu Composites by Mechanical Alloying[J];Mining and Metallurgical Engineering;2009-04
5 HE Wei 1,2,DUAN Xue-chen 1,2,ZHU Lei 1,2 (1. Key Laboratory of Nonferrous Metal Materials Science and Engineering,Ministry of Education,Central South University,Changsha 410083,China;2. School of Materials Science and Engineering,Central South University,Changsha 410083,China);Characterization of ultrafine copper powder prepared by novel electrodeposition method[J];中南大学学报(英文版);2009-05
6 TANG Zhe,LIU Bin,LI Yu-xin(College of Material Science and Engineering,North University of China,Taiyuan 030051,China);Research on Ni Activation sintering Process for Mo-30% Cu Composite Material[J];Foundry Technology;2012-02
7 MA Yun-zhu,HUANG Qian-fang,LIU Wen-sheng(State Key Laboratory of Powder Metallurgy,Central South University,Changsha 410083,China);Process of CeO_2 coating on tungsten fibers by sol-gel method[J];The Chinese Journal of Nonferrous Metals;2012-11
China Proceedings of conference Full-text Database 1 Hits
1 GU Yi~1,JIANG Guo-Sheng~1,WANG Zhi-fa~1,LIU Jin-wen~1 (1.School of Material Science and Engineering,Key Lab.Of Material Science and Engineering,Ministry of Education, Central South University,Changsha,China,410083);Effect of infiltration time on the density of Mo70-Cu alloy[A];[C];2010
【Secondary Citations】
Chinese Journal Full-text Database 10 Hits
1 Tian Minbo,Liang Tongxiang,He Wei (Department of Materials Science and Engineering,Qinghua University,Beijing, 100084);Electronic Packaging Technologies and Materials[J];SEMICONDUCTOR INFORMATION;1995-04
2 ;Ecomaterials--An Advanced Materials Research for the 21st Century[J];Materials Review;1994-05
3 CHEN Wenge WANG Chun (School of Materials Science and Engineering,Xi'an University of Technology,Xi'an 710048);Advances in Copper-matrix Material for Leadframe and Electronic Packaging of Integrated Circuitry (IC)[J];Materials Review;2002-07
4 HUANG Qiang JIN Yanping GU Mingyuan (State Key Lab, of Metal Matrix Composites,Shanghai Jlaotong University ,Shanghai 200030);Processing Routes of Metal Matrix Composite for Electronic Packaging[J];Materials Review;2002-09
5 ZHAO Xiaopeng; ZHOU Benlian(Institute of Metal Research, Chinese Academy of Sciences)(International Centerfor Materials Physics, Chinese Academy of Sciences)LUO Chongrong; WANG Jinhua; LIU Jianwei(Northwestern Polytechnical University);A MODEL OF INTELLIGENT MATERIAL WITH SELF-REPAIR FUNCTION[J];CHINESE JOURNAL OF MATERIAL RESEARCH;1996-01
6 ZHANG Hai-po,RUAN Jian-ming (State Key Laboratory for Powder Metallurgy, Central South University, Changsha 410083, China);The development of materials and technology of electronic packaging[J];Materials Science and Engineering of Powder Metallargy;2003-03
7 CHEN Wen ge,DING Bing jun (Material Sciece and Engineering Institute,Xi'an Jiaotong University,Xi'an 710004,China);THE PROGRESS AND RESEARCH OF W-Cu MATRIX COMPOSITES[J];Powder Metallurgy Industry;2001-03
8 Li Yunping, Qu Xuanhui, Zheng Zhoushun, Lei Changming, Duan Baihua (National Key Lab for Powder Metallurgy, Central South University, Changsha 410083, China);The Present State in Research and Development Trend in Industrialization of PIM W-Cu Composites[J];Powder Metallurgy Technology;2003-02
9 Tang Liegui;Zhu Yuqin(Laboratory of cellulose and Lignocellulosics Chemistry Chinese Academy of Sciences Guangzhou,P.O. Box1122,Guangzhou,510650,China);Functional Cellulosics[J];JOURNAL OF FUNCTIONAL MATERIALS;1995-02
10 Chen Wenge,Liu Ronbing (School of Material Science and Engineer,Xian University of Technology,Xian 710048);Comparison Analysis of Microstructures and Properties of W/Cu and Mo/Cu Composites[J];Electrical Engineering Alloy;2001-04
©2006 Tsinghua Tongfang Knowledge Network Technology Co., Ltd.(Beijing)(TTKN) All rights reserved