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《China Powder Science and Technology》 2007-01
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Research for Reunion and Resolve Method of Boron Carbide Submicron Powder

LIN Lei-ting, WANG Zhen-guo (Mudanjiang Jingangzuan Boron Carbide Co, Ltd. Mudanjiang 157009, china)  
The reunion reason of boron carbide submicron powders in manufacturing process was analyzed, spray drying and airflow crash were adopted to deal with the materials. The reunion could be avoided by spray drying, but its energy consumption was higher than dry box and the submicron powders should be reclaimed. Airflow crash was used to deal with reunion powders, the yield of powders and the wearing of grade wheel were satisfaction, this process method is adapting to deal with the reunion powders with no other equipment.
【CateGory Index】: TB44
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