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《Engineering Mechanics》 2013-09
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RESEARCH OF ELECTROMIGRATION FAILURE FOR FCBGA SOLDER JOINT IN MULTI-PHYSICAL FIELD

LIANG Li-hua;ZHANG Jin-chao;ZHANG Yuan-xiang;College of Mechanical Engineering,Zhejiang University of Technology;College of Mechanical Engineering,Quzhou University;  
Based on FEM and submodel technique,the electric-thermal-structural coupled analysis for flip chip ball grid array(FCBGA) package is performed to obtain the distribution of current density,temperature and stress for the key solder joint.By using atomic flux divergence(AFD) method and atomic density integral(ADI) method,the electromigration(EM) characteristics and influence factors of the key solder joint are studied.The SEM image of the key solder joint under EM demonstrates that the ADI method with the consideration of four driving mechanisms,such as electron wind force,stress gradient,temperature gradient and atomic density gradient,can effectively predict the EM failure location.The atomic density gradient(chemical potential) usually can retard EM phenomenon.
【Fund】: 浙江省自然科学基金项目(Y6110641)
【CateGory Index】: TN405
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【Citations】
Chinese Journal Full-text Database 6 Hits
1 Zhang Jinsong,Xi Hongjia,Wu Yiping,and Wu Fengshun (Wuhan National Laboratory for Optoelectronics,Wuhan 430074,China);Electromigration of Cu-Ni/Solder/Ni-Cu Structures[J];Journal of Semiconductors;2008-01
2 YANG Yan, YIN Limeng, MA Xiao, ZHANG Xinping (School of Materials Science and Engineering, South China University of Technology, Guangzhou 510640, China);Strength reduction of Sn-3.0Ag-0.5Cu solder joints caused by electromigration and the effects of joint size on strength reduction[J];Electronic Components and Materials;2010-02
3 CHANG Hong,LI Mingyu (State Key Lab of Advanced Welding Production Technology,Harbin Institute of Technology Shenzhen Graduate School,Shenzhen 518055,Guangdong Province,China);Influence of electromigration on the shear strength of Sn3.0Ag0.5Cu Pb-free solder joint[J];Electronic Components and Materials;2011-02
4 MAO Jiang-hui , YANG Xian-jie , GAO Qing(Department of Applied Mechanics and Engineering, Southwest Jiaotong University, Chengdu 610031, China);FINITE ELEMENT IMPLEMENTATION TO TIME-DEPENDENT CONSTITUTIVE MODEL OF SOLDER IN MICRO-ELECTRONIC PACKAGING[J];Engineering Mechanics;2009-07
5 Lihua Liang Yuanxiang Zhang Yong Liu Xuefan Chen(College of Mechanical Engineering,Zhejiang University of Technology,Hangzhou,310032);A NEW ALGORITHM FOR ELECTROMIGRATION FAILURE ANALYSIS OF METAL INTERCONNECTS[J];Chinese Journal of Solid Mechanics;2010-02
6 Yuanxiang Zhang Lihua Liang Yong Liu (College of Mechanical Engineering,Zhejiang University of Technology,Hangzhou,310014);DESIGN OF EXPERIMENTS AND SENSITIVITY ANALYSIS FOR ELECTROMIGRATION ON SOLDER JOINTS[J];Chinese Journal of Solid Mechanics;2011-02
【Co-citations】
Chinese Journal Full-text Database 5 Hits
1 LI Wang-yun YIN Li-meng WEI Song XU Zhang-liang(Chongqing University of Science and Technology,Chongqing 401331);Size Effect of Solder Joint Interconnection on Lead-free Microelectronic Packaging[J];Journal of Chongqing University of Science and Technology(Natural Sciences Edition);2011-06
2 YIN Limeng,LI Wangyun,WEI Song,XU Zhangliang(School of Metallurgy and Materials Engineering,Chongqing University of Science and Technology,Chongqing 401331,China);Influences of solder joint size on the tensile fracture strength of microscale solder joints[J];Electronic Components and Materials;2011-09
3 Yuanxiang Zhang Lihua Liang Yong Liu (College of Mechanical Engineering,Zhejiang University of Technology,Hangzhou,310014);DESIGN OF EXPERIMENTS AND SENSITIVITY ANALYSIS FOR ELECTROMIGRATION ON SOLDER JOINTS[J];Chinese Journal of Solid Mechanics;2011-02
4 FANG Jiaqiang,YU Zhishui,CHANG Wenlong,WANG Bo,JIANG Heming(College of Materials Engineering,Shanghai University of Engineering Science,Shanghai 201620,China);Analysis and Research on Electro-Migration Phenomenon in Solder Joints for Microelectronics Packaging[J];Journal of Shanghai University of Engineering Science;2013-01
5 Zhang Jin-Song1) Wu Yi-Ping2) Wang Yong-Guo1) Tao Yuan2) 1)(School of Mechatronics Engineering and Automation,Shanghai University,Shanghai 200072,China) 2)(School of Materials Science and Engineering,Huazhong University of Science and Technology,Wuhan 430074,China);Thermomigration in micro interconnects in integrated circuits[J];Acta Physica Sinica;2010-06
【Secondary Citations】
Chinese Journal Full-text Database 10 Hits
1 Wu Yiping 1,2,,Zhang Jinsong1,Wu Fengshun1,and An Bing1(1 State Key Laboratory of Plastic Forming Simulation & Die Technology,Huazhong University of Science & Technology,Wuhan 430074,China) (2 Wuhan National Laboratory for Optoelectronics,Wuhan 430074,China);Electromigration of SnAgCu Solder Interconnects[J];Chinese Journal of Semiconductors;2006-06
2 HE Hong-wen, XU Guang-chen, GUO Fu (School of Materials Science & Engineering, Beijing University of Technology, Beijing 100022, China);Progress of study on electromigration reliability in lead-free solder[J];Electronic Components and Materials;2008-05
3 WANG Lingling,SUN Fenglian,WANG Lifeng,LIU Yang(School of Material Science & Engineering,Harbin University of Science and Technology,Harbin 150040,China);Effect of reflow soldering on IMC and shear strength of SnAgCu solder joint[J];Electronic Components and Materials;2009-09
4 YANG Yan,YIN Limeng,ZHANG Xinping (School of Materials Science and Engineering,South China University of Technology,Guangzhou 510640,China);Effects of isothermal aging and joint size on the strength of Sn-3.0Ag-0.5Cu microscale solder joints[J];Electronic Components and Materials;2009-10
5 YIN Li-meng,ZHANG Xin-ping(School of Mechanical Science and Engineering,South China University of Technology,Guangzhou,Guangdong 510640,China);Electromigration in Micro-Interconnections of Electronic Packaging[J];Acta Electronica Sinica;2008-08
6 KANG Guo-zheng (Department of Applied Mechanics and Engineering, Southwest Jiaotong University, Chengdu, Sichuan 610031, China);RATCHETING OF CYCLICALLY STABLE MATERIALS: II. IMPLICIT STRESS INTEGRATION ALGORITHM AND FINITE ELEMENT IMPLEMENTATION[J];Engineering Mechanics;2005-03
7 Peng Bin Zhang Wanli Zhang Wenxu Jiang Hongchuan Yang Shiqing(School of Microelectronics and Solid-state Electronics,University of Electronic Science and Technology of China,Chengdu,610054);FINITE ELEMENT SIMULATIONS OF THE MAGNETOSTRICTIVE FILM[J];Acta Mechanica Solida Sinica;2006-03
8 Liu Tao~1 Deng Zichen~(1,2)(~1 Department of Engineering Mechanics,Northwestern Polytechnical University,Xi'an,710072)(~2 State Key Laboratory of Structural Analysis of Industrial Equipment,Dalian University of Technology,Dalian,116023);THE DESIGN OPTIMIZATION FOR THERMAL-STRESS COUPLED STRUCTURES BY CONSIDERING STRUCTURAL DESIGN VARIABLES AND MATERIAL DESIGN VARIABLES SIMULTANEOUSLY[J];Acta Mechanica Solida Sinica;2006-04
9 Lihua Liang Yuanxiang Zhang Yong Liu Xuefan Chen(College of Mechanical Engineering,Zhejiang University of Technology,Hangzhou,310032);A NEW ALGORITHM FOR ELECTROMIGRATION FAILURE ANALYSIS OF METAL INTERCONNECTS[J];Chinese Journal of Solid Mechanics;2010-02
10 KANG Guo-zheng (Dept.of Applied Mechanics and Engineering,Southwest Jiaotong University,Chengdu 610031,China);Implicit stress integration and finite element implementation of constitutive model for cyclic hardening materials[J];Chinese Journal of Computational Mechanics;2005-05
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