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《Opto-Electronic Engineering》 2010-01
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Temperature in Micro-channel Heat Sink of High Power Semiconductor Laser Array

SUN Meia,SU Zhoub,WANG Jing-qina,ZHAO Hong-dongb ( a. College of Graduate Student; b. School of Information Engineering,Hebei University of Technology,Tianjin 300401,China )  
The micro-channel heat sink is an effective way to solve the heat removal problem in high power semiconductor laser array. The temperature in a high power semiconductor laser is analyzed by the finite element method. The temperature is obtained in a single and 3,5,9 micro-channels heat sinks with the space of 100 μm and transverse size 200μm×60μm. The effect of number of micro-channels on maximum temperature is presented. The result shows that the temperature in the semiconductor lasers in 36 A injected current stable operation can be cooled down to 306 K by the heat sink made up of 9 micro-channels,while the temperature is dropped to 342 K for a single micro-channel. The temperature distribution is also simulated with increasing the space between micro-channels. It is found that the temperature can be dropped to 308 K by 5 micro-channels with the space of 260 μm.
【Fund】: 教育部高等学校博士学科点专项科研基金(20070080001);; 河北省自然科学基金(F2007000096)
【CateGory Index】: TN248.4
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