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《Materials for Mechanical Engineering》 2010-01
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Phase-Field Simulation of Al-Cu Binary Alloy during Directional Solidification

YUAN Xun-feng,DING Yu-tian,HU Yong(State Key Lab.of Advanced New Non-ferrous Metal Materials,Gansu Province,Lanzhou University of Technology,Lanzhou 730050,China)  
The phase-field model based on KKS model which couples the solute field was used to simulate the process during directional solidification for Al-Cu binary alloy.Frozen temperature approximation was adopted to simplify the modeling.The effects of the parameters such as an isotropy coefficient,interface energy and interface thickness on interface morphology and micro-segregation were formulated.The results show that shallow cellular dendrite growth was the major growth pattern in isotropic circumstances.After introduction of the anisotropy,with the increase of the anisotropy coefficient the crystal growth transformed to deep cell from shallow cell.With the increase of interface energy and interface thickness,the crystal growth transformed to shallow cell from deep cell.
【CateGory Index】: TG146.21
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