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《Journal of North China Institute of Astronautic Engineer》 2005-03
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Application and Development of Surface Mount Technology

GU Ai-yun~1 ZHAO Dong-ming~2 CAO Bai-yang~3(1.The Ministry of Security of PRC the First Research Institute, Beijing 100000;2.Langfang Normal College, Langfang 065000;3.Electronics Engineering Department, North China Institute of Astronautic Engineering, Langfang 065000,China)  
It is in the special stage to transfer from lead solder to lead-free solder. The things such as lead-free material、PCB、component、examination and reliability have no common standard. In this paper, the actuality of lead-free solder and its characteristics and countermeasures are introduced in detail, otherwise, the main problems of lead-free solder and the problems when lead solder and lead-free solder were used together that should be paid attention to during the transfer stage are also analyzed entirely.
【CateGory Index】: TN405
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【References】
Chinese Journal Full-text Database 8 Hits
1 ;Problem and Solution in Lead-free Electronics Assembly(Continued)[J];Equipment for Electronic Products Manufacturing;2006-06
2 LIANG Ya-qin(Nantong Shipping College,Nantong 226001,China);Analysis and Countermeasure about Solderability of Aluminum Electrolytic Capacitor[J];Electronic Product Reliability and Environmental Testing;2006-03
3 Luo Bing, Zhang Yun(Automation College, GuangDongUniversity of Technology,Guangzhou, 510090,China);SMT Lead-free’s Influence on AOI[J];Electronics Quality;2006-03
4 Luo Bing (Computer Department of Nanhai College,South China Normal University,Guangdong Foshan 528225);SMT Lead-free Solder Paste Deposit Quality Optimization by Taguchi Method[J];Electronics Quality;2008-08
5 FU Xin,ZHANG Neng-hua,SONG Jia-ning (National Engineering Research Center of Mobile Communication,Guangzhou 510310,China);Discussion of Lead and Lead-free Mixed Assembly Technics[J];Electronics Process Technology;2010-02
6 YAO Na1,2,HOU Hong2,WANG Lin-quan1,ZHOU You-ya2,LI Fa-sheng2 (1. College of Resources and Environment,Northwest Agriculture and Forest University,Yangling 712100,China; 2. Department of Soil Pollution Control,Chinese Research Academy of Environmental Science,Beijing 100012,China);Adsorption Behavior and Speciation Transformation of Ag~+ in Phaeozem and Red Soil[J];Environmental Science;2010-04
7 XU Dong-xia,LEI Yong-ping,XIA Zhi-dong,GUO Fu,SHI Yao-wu(College of Materials Science and Eng.,Beijing Univ.of Technology,Beijing 100022,China);The Current Status and Trends in Research on Soldering Flux for Lead-free Solder in Electronic Assembly[J];Journal of Shanghai Jiaotong University;2007-S2
8 Han Xiangheng;PCB and Lead-free[J];Printed Circuit Information;2005-11
【Co-references】
Chinese Journal Full-text Database 10 Hits
1 LIU Fang (Anyang Shenghua Scientific Technology Economic and Trade Development Company,Anyang 455000,China);The Retrieve of Silver in Liquid Waste[J];Journal of Aayang Teachers College;2000-04
2 PAN Kai-lin, ZHOU Bin, YAN Yi-lin, WEI Li-pu (Department of Mechatronics & Traffic Engineering, Guilin University of Electronic Technology, Guilin 541004, China);Lead-Free Transfer and Transition Technology[J];Semiconductor Technology;2007-02
3 ZHAO Maiqun YU Xiliang ZHANG Weihua ZHAO Gaoyang (School of Materials Science and Engineering,Xi'an University of Technology,Xi'an 710048);A Review of Preparation Method of Lead-free Solder Powder in SMT[J];Materials Review;2003-12
4 ZHANG Shuguang HE Lijun ZHANG Shaoming SHI Likai (Beijing General Research Institute for Non-ferrous Metals,Beijing 100088);Progress of Research and Application of Lead-free Solder[J];Materials Review;2004-06
5 OMRON;Inspection for Leadless Tin Solder by AOI[J];Equipment For Electronic Products Manufacturing;2003-03
6 SHIJian-wei1,2, HE Peng1, QIAN Yi-yu1, YUAN He-ping2(1.Harbin Institute of Technology, Harbin, 150001, China2.Sun East Electronic Technology (ShenZhen) Company Ltd, Shenzhen, 518103, China);Technology Demands and Test Methods of Performance of Solder Paste[J];Equipment For Electronic Products Manufacturing;2004-12
7 LIU Jun(The 27th Research Institute of CETC, Zheng zhou 450005,China);Application of Non-lead Welding Technology in Manual Welding[J];Equipment For Electronic Products Manufacturing;2004-12
8 ;Problem and Solution in Lead-free Electronics Assembly(Continued)[J];Equipment for Electronic Products Manufacturing;2006-06
9 Wu Nian-zu Wu Jian (Shanghai huaqing solder material & technology Co., Ltd., Shanghai 200030, China; Shanghai superior flux &mfg. Co., Ltd., Shanghai 200030, China);Soldering technology for Lead-free and problems in its application[J];Electronics & Packaging;2005-05
10 LU Yun, YANG Bang-chao, FENG Zhe-sheng (Institute of Micro-electronics and Solid Electronics, University of Science and Technology, Chengdu Sichuan 610054);A New Solder Technology:Rinse-free Flux and Lead-free Solder Tin Paste[J];Electronic Components $ Materials;2002-10
【Secondary References】
Chinese Journal Full-text Database 9 Hits
1 ZHANG Bing-bing,LEI Yong-ping,XU Dong-xia,LI Guo-wei,XIA Zhi-dong(Laboratory of Advanced Electronic Joining Materials,Beijing University of Technology,Beijing 100022,China);Study on a VOC-free flux for lead-free solder[J];Electronic Components and Materials;2008-01
2 SHI Yao-wu, LEI Yong-ping, XIA Zhi-dong, GUO Fu, LI Xiao-yan (School of Materials Science and Engineering, Beijing University of Technology, Beijing 100022, China);Design and prospect of lead-free solder paste[J];Electronic Components and Materials;2008-09
3 Jin Xi, Qian Xiao-yao, Hong Taog( China Jiliang University , Zhejiang Hangzhou 310018);Application of DOE on Quality Improvement in SMT Screen Printing[J];Electronics Quality;2009-09
4 FU Xin,ZHANG Neng-hua,SONG Jia-ning (National Engineering Research Center of Mobile Communication,Guangzhou 510310,China);Discussion of Lead and Lead-free Mixed Assembly Technics[J];Electronics Process Technology;2010-02
5 LIU Wen-sheng,HUANG Guo-ji,MA Yun-zhu,PENG Fen,CUI Peng(State Key Laboratory of Powder Metallurgy,Central South University,Changsha 410083,China);Investigation and development trends of fluxing agent for solder[J];Materials Science and Engineering of Powder Metallurgy;2010-02
6 SUN Shou-hong(Changchun Institute of Optics,Fine Mechanics and Physics,Chinese Academy of Sciences,Changchun 130033,China);Reverse Technology from Lead-free Devices to Lead Devices[J];Electronics Process Technology;2010-05
7 LI Jiu-feng(Luoyang Institute of Electro-Optical Equipment of AVIC,Luoyang 471009,China);Design for Manufacture Analyze of PCB in the Automatization Assembly[J];Electronics Process Technology;2011-02
8 CHEN Xu-dong,SHI Jian-feng(Department of Mechanical Engineering,Nantong Vocational College,Nantong 226007,China);The Influences of the Shaping Mould Design on the Performance of Capacitor and the Corresponding Countermeasure[J];Journal of Nantong Vocational College;2010-02
9 Pen Chen, Gu Jufen;Non-lead Technology and Solder Paste Printing[J];Screen Printing;2007-07
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