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《Journal of North China Institute of Astronautic Engineer》 2005-03
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Reflow Solder Profile Development

CAO Bai-yang ZHAO Xiao-qing LIANG Wan-lei(Electronics Engineering Department,North China Institute of Astronautic Engineering,Langfang 065000,China)  
In this paper, we analyze the function of the thermal reflow profile in reflow process, characteristics of reflow process, factors of thermal reflow profile. How to build up methods of thermal reflow profile in the idea of thermal capacity. How to adjust thermal reflow profile. We control thermal reflow profile for increasing quality of reflow process and decreasing failures of reflow process.
【CateGory Index】: TN405
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【References】
Chinese Journal Full-text Database 1 Hits
1 ZHU Qiwen,ZHOU Jingquan(College of Opto-electronic Engineering,Nanjing University of Posts & Telecommunications,Nanjing,210003,China);Design of Temperature Instrument of Reflow Soldering in SMT[J];Modern Electronics Technique;2007-01
【Co-references】
Chinese Journal Full-text Database 10 Hits
1 YANG Qi-wei, CHEN Yi (Dept. of Computer, Guilin University of Electronic Technology, Guilin 541004, China);Contrast Research of Universal Temperature Control Methods[J];Ordnance Industry Automation;2005-06
2 Zhao Xianghua, Gao Jun,Wang Zhaoan (Xi'an Jiaotong University);A Practical Detecting Circuit for Linear Isolation[J];ELECTROTECHNICAL JOURNAL;2000-10
3 SHI Jian-wei1,2, HE Peng1, QIAN Yi-yu1, YUAN He-ping2(1.Harbin Institute of Technology, Harbin, 150001, China2.Sun East Electronic technology (ShenZhen) company Lt.d, Shenzhen, 518103 China);Prospect of Reflow Soldering Process[J];Equipment For Electronic Products Manufacturing;2005-01
4 YANG Yan, JING Zhan-rong, BI Qiang, HAN Xing (Northwestern Polytechnical University, Xi' an 710072, China);Study on the digital PID control of the brushless DC motor[J];Electric Machines and Control;2003-04
5 Gu Yong-lian Yang Bang-chao (University of Electronic Science and Techlology of China, Chengdu Sichuan 610054, China );The reliability of Lead-free Solder Joint[J];Electronics & Packaging;2005-05
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8 DNOG Jing-yu(CETC No. 27 Research Institute, ZhengZhou450005,China);Pin-through-hole Reflow Soldering Technology[J];Electronics Process Technology;2004-05
9 HUANG Bing-yuan, HAN Guo-ming, FAN Qiang,MAO Xin-long(Tianjin University,Tianjin300072,China) ;Research Status of Reflow Soldering Process in SMT[J];Electronics Process Technology;2004-06
10 XU Long-hui,JIANG Ting-biao(Guilin University of Electronic Technology,Guilin 541004,China);Reliability Analysis of Backwards Compatible Mixed Solder Joint[J];Electronics Process Technology;2006-05
【Secondary References】
Chinese Journal Full-text Database 1 Hits
1 CAO Biao,FAN Fengxin,ZENG Min,SHAO Lanjuan(Department of Mechanical and Automotive Engineering,South China University of Technology,Guangzhou 510640,China);Development of precise inverter reflow-soldering power supply with waveform control[J];Transactions of the China Welding Institution;2009-06
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