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《Journal of North China Institute of Aerospace Engineering》 2016-01
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A Research on Multichip Module Assembly Key Technology

Yang Hongzhen;Cao Xinyu;Guan Xiaodan;School of Electronic and Control Engineering,North China Institute of Aerospace Engineering;  
In this paper,we study the problematics of the key process and the key technology in the process of multichip assembly. The key technologies of the paper include wire bonding technology,lead free flip chip technology and tape-automated bonding technology.These key technologies can provide guidance and reference for micro electronics manufacturing enterprises. Mastering these key technologies can greatly improve the production efficiency,product quality and reliability of multichip module.
【Fund】: 北华航天工业学院科研基金项目(KY-2014-04)(KY-2014-17)(KY-2014-15)
【CateGory Index】: TN405
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