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《Infrared Technology》 2007-02
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Indium Bump Reflow in Flip Chip Inter-connection of Infrared Focal Plane Array Detectors

SHEN Tian-zhu(Kunming Institute of Physics,Kunming Yunnan 650223)  
Indium Bump Reflow is a key technonogy flip chip for Inter-connection.The problems in indium bump reflow of flip chip inter-connection of Focal Plane Arrays are discussed.An optimized procedure for the indium bump reflow is shown.
【Fund】: 国防重点预研基金项目
【CateGory Index】: TN215
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【Citations】
Chinese Journal Full-text Database 2 Hits
1 LEI Sheng-qiong,JIANG Jun,ZHOU Fang,YANG Bin (Kunming Institute of Physics, Kunming 650223,China);The Indium Bumping Process Design and Application On 64×64FPAROIC[J];Infrared Technology;2002-02
2 HUANG Jiang-ping,YANG Chun-li,LI li,YANG Deng-quan,ZHANG Li-hua ,LI Yu-ying (Kunming Institute of Physics, Kunming 650223,China);A Technical Study of Indium Film and Indium Bump Fabric ation for 128×128 Hybrid Ferroelectric UFPAs[J];Infrared Technology;2003-06
【Co-citations】
Chinese Journal Full-text Database 10 Hits
1 WANG Bao-guo,ZHANG Jing-lin,PENG Ying-jian(College of Chemical Engineering and Environment,North University of China,Taiyuan 030051,China);Effect of Ligand Bonding Agent-603 on the Impact Sensitivity of Sub-micron CL-20[J];Chinese Journal of Explosives & Propellants;2008-04
2 Deng Rui Li Min Zhang Zuoguang Jia Jingjing(School of Materials Science and Engineering,Beijing University of Aeronautics and Astronautics,Beijing 100083,China);Surface free energy of basalt and glass fibers by contact angle method[J];Journal of Beijing University of Aeronautics and Astronautics;2007-11
3 ZHANG Zheng-xi HUA You-qing CHEN Jian-feng WANG Yu-hong(1. College of Materials Science and Engineering; 2. Research Center of the Ministry of Education for High Gravity Enigeering and Technology, Beijing University of Chemical Technology, Beijing 1000;Surface modification and adsorption mechanism of nanometer[J];Journal of Beijing University of Chemical Technology;2002-03
4 WANG Zheng 1;ZHAO Xing-zhi 2;GUO Wen-jing 1. 1 Research Institute of Wood Industry, Chinese Academy of Forestry, Beijing,100091, P. R. China; 2 School of Material Science and Technology, Beijing Forestry University, 100083, P. R. China.;Process factors and performances of recycled plastic-wood fiber composites.[J];Journal of Beijing Forestry University;2005-01
5 XIE Yong-qun;YANG Wen-bin;LI Qiu-gen;LIN Xiao-ping.College of Material Engineering,Fujian Agriculture and Forestry University,Fuzhou,350002,P.R.China.;Dimensional stability of ultra-low-density plant fiber materials during drying process[J];Journal of Beijing Forestry University;2008-06
6 HUANG Hengjian, DONG Haishan, ZHANG Ming,HUA Cheng, XI Yan, CHENG Kemei(Institute of Chemical Materials, CAEP, Mianyang621900, Sichuan, China);A study on the interface action between RDX and desensitizers and related effects on impact sensitivity[J];Explosion and Shock Waves;2003-02
7 L Chunling, ZHANG Jinglin (Department of Environment and Safety Engineering, North China Institute of Technology, Taiyuan 030051, Shanxi, China);Influence of particle size on the impact sensitivity of HMX[J];Explosion and Shock Waves;2003-05
8 ZHANG Jing lin,L Chun ling, WANG Jin yü, TAN Ying xin(Deptartment of Environment and Safety Engineering, North China Institute of Technology,Taiyuan 030051, Shanxi, China);Selectivity of the sensitivity of the sub-micron explosive[J];Explosion and Shock Waves;2004-01
9 WANG Guoyu1, ZHANG Xin2 (1.Faculty of Sci, Jiangsu University, Zhenjiang 212013,China; 2.Dept of Math and Phys,Shanghai Institute of Technology,Shanghai 200235,China);Measurement of liquid surface tension coefficient[J];Journal of Transducer Technology;2003-07
10 YIN Bao-lin,WEI Xi-lian,SUN De zhi(Department of Chemistry,Liaocheng Teachers University,Liaocheng 252059,China);Adsorption of a cationic surfactant on activated carbon[J];China Surfactant Detergent & Cosmetics;2002-05
China Proceedings of conference Full-text Database 10 Hits
1 XU Ming, CAO Chunyu (China National Pulp and Paper Research Institute, Beijing 100020, China);Study on Influence of Correlative Factors on Simulation of OCC Papermaking Process of Closed Water System[A];[C];2008
2 ;The study of Alkali binding by C-S-H and C-A-S-H gels[A];[C];2008
3 NI Bing LUO Zhi-guo ZOU Zong-shu (School of Materials and Metallurgy,Northeastern University,Shenyang,Liaoning 110004,China);Thermodynamics Analysis on Bubble Attachment to Solid Wall in Liquid[A];[C];2008
4 Zhou Xinqun Zhou Changji (Chinese Academy of Agricultural Engineering, Beijing 100026, China);Study on the Technical Standards for Greenhouse Glazing Materials[A];Chinese Society of Agricultural Engineering[C];2006
5 Wang Huafeng Jia Xiaopeng Fang Xin Li Zhanhua LNM, Institute of Mechanics,CAS in Beijing China,Beijing, 100080 Tsinghua University,Beijing, 100084 Graduate School of Chinese Academy of Sciences, Beijing, 100049;Numerical Simulation and Optimization about the Sampling Process Driven by Pressure in Electrophoresis Chip[A];[C];2005
6 XU Ming CAO Chun-yu (China National Pulp and Paper Research Institute,Beijing 100020,China);Study on Influence of Correlative Factors on Simulation of OCC Papermaking Process of Closed Water System[A];[C];2008
7 XU Ming CAO Chun-yu (China National Pulp and Paper Research Institute,Beijing 100020,China);Study on Influence of Correlative Factors on Simulation of OCC Papermaking Process of Closed Water System[A];[C];2008
8 XUE Lian MENG Li-ya YUAN Xiang-hui (Key Lab of Optoelectronic Technology & System of Ministry of Education,Chongqing University,Chongqing 400030,China);Imaging system for 320×240 pyroelectric IRFPA[A];[C];2007
9 JIA Jingjing,LI Min,GU Yizhuo,WANG Ji,ZHANG Zuoguang (School of Materials Science and Engineering,Beijing University of Aeronautics and Astronautics,Beijing 100083);Measurement and Analysis on Surface Tension of E51 Epoxy Resin During Curing Process[A];[C];2008
10 Yu Qun and Li Zhanhua (LNM laboratory,Institute of mechanics,Chinese Academy of Science,Beijing,100080);Electroosmosis velocity measurement in a microchannel with different wall surface material[A];[C];2007
【Secondary Citations】
Chinese Journal Full-text Database 1 Hits
1 LEI Sheng-qiong,JIANG Jun,ZHOU Fang,YANG Bin (Kunming Institute of Physics, Kunming 650223,China);The Indium Bumping Process Design and Application On 64×64FPAROIC[J];Infrared Technology;2002-02
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