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《Laser & Infrared》 2011-01
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Effect of UBM of ROIC on indium bump height

XIE Heng,LIANG Zong-jiu,YANG Ya-ru(North China Research Institute of Electro-optics,Beijing 100015,China)  
It had difficulty in flip chip bonding cause the indium bump height of ROIC was too low in large IRFPAs.We die an experiment upon dimension of UBM and analyzed its influence on indium bump height.The indium bump height of ROIC is in direct proportion to the indium bump size and film thickness,but in inverse proportion to the UBM size of ROIC.To solve the problem,an improved thread of research thoughts is presented in this paper.
【CateGory Index】: TN215
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【Citations】
Chinese Journal Full-text Database 4 Hits
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