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《Laser & Infrared》 2011-03
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Research of thermal excitation method in infrared NDT for multiple interface debonding

FAN Dan-dan,PAN Jin-xiao,LIU bin,LIU Zi-long(Institute of Signal Capturing and Processing Technology,North University of China,Taiyuan 030051,China)  
The method of thermal excitation directly influences the defect detection and actual test results in infrared NDT.In the paper,the thermal excitation methods are analysed and compared in thin adhesive layer interface debonding detection.We simulate the different thermal excitations in infrared NDT with finite element analysis software COMSOL by constructing a defect model of multi-layered interface debonding.The research of the relationship between simulation results and thermal excitations provides foundation for accurate infrared NDT experiment.
【Fund】: 国家自然科学基金(No.60772102);; 国防重点实验室基金(No.9140c12040051010)资助
【CateGory Index】: TG115.28
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