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Nonlinear finite element analysis on electronic chip package warpage

CHU Chunqin, ZHENG Bailin, HE Pengfei(Institute of Applied Mechanics, Tongji Univ., Shanghai 200092, China)  
According to the fact that the electronic chip package warpage problems are mainly caused by mismatch of material properties and geometric structure of each component, and inhomogeneous temerature in molding process, the different materials of lead-frame and Epoxy Molding Compound(EMC) are assembled considering material properties merely. The influence on warpage under different compoundings are discussed by finite element analysis softwares MSC Patran/Nastran. It is obtained that warpage is greatly upward if the material properties between lead-frame and EMC are rather different, a little upward if the property difference is small, and downward if the property difference is on the rather small side.
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