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《Physical Testing and Chemical Analysis Part A Physical Testing》 2003-09
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EVALUATION OF SEVERAL IMPORTANT MECHANICAL PROPERTIES FOR THIN FILMS

LI Jia-bao, QIN Ming, MA Su-yuan, CHEN Chang-rong (Shenyang National Laboratory for Materials Science, Institute of Metal Research, The Chinese Academy of Sciences, Shenyang 110016, China) Vincent JI (LM3 ESA CNRS 8006, ENSAM, 151 Bld. de l′Hpital, Paris 75013, France)  
A new method is presented to measure the equivalent stress-equivalent uniaxial strain curve, yield strength and strain-hardening exponent of a polycrystalline film on substrate using X-ray stress analysis and strain gauge techniques. Using this method, the obtained proof stresses corresponding to permanent equivalent uniaxial strain 0.1% and 0.2% are 4.2GPa and 4.4GPa respectively for a 2.5μm thick TiN film, and 328MPa and 415MPa respectively for a 2.4μm thick Cu film. By stepwise removal of a TiN film having a thickness of 2.3μm and measuring the variation in substrate curvature, the depth distribution of the residual stress in the film were acquired. A new technique for measuring the Poisson′s ratio of thin films using X-ray stress analysis technique is proposed, and the measured value for a TiN film is 0.27. A tentative idea for getting the Young′s modulus of ceramic films is also put forward in this paper.
【Fund】: 国家自然科学基金资助项目(59931010 50272067)
【CateGory Index】: O484.5
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