A Novel Approach to V-Groove Etching
Zhong Binfu (Sichuan Institute of Solid-state Circuits)
In this article, a new technique for V-groove etching is presented. In this procedure, more buffering agents such as isopropyl alcohol and ethyl alcohol are added in addition to the application of the formerly used etchant of KOH, and strickt control over temperature is adopted, to achieve a good V-groove and thus further reducing the die size. For the convenience of grinding and polishing, a marker is placed within the die spacing to insure both the thickness and quality of the single crystal layer.