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《Microelectronics》 2009-01
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Research Progress in Electronic Component Heat Dissipation Using Thermoelectric Cooling Technology

ZHU Dongsheng,LEI Junxi,WANG Changhong,HU Hanying(Key Lab of Enhanced Heat Transfer and Energy Conservation of Ministry of Education,School of Chemistry andChemical Engineering,South China University of Technology,Guangzhou 510640,P.R.China)  
Based on the analysis of the principle of thermoelectric refrigeration and theory of thermoelectric cooling(TEC) for electronic component thermal management,progress in research and experiments of IC chip thermoelectric cooling was described in detail,including heat dissipation of the whole exterior and "hot spot" removal.Numerical simulation and type-selection optimization of TEC were also reported.It is pointed out that application research of IC chip thermoelectric cooling in China is quite limited,and so,the research level of China in this area is distant away from developed countries.
【Fund】: 国家高技术发展研究(863)计划基金资助项目:余热回收利用的节能新装备关键技术研究(2007AA05Z200)
【CateGory Index】: TN605
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