Full-Text Search:
Home|About CNKI|User Service|中文
Add to Favorite Get Latest Update

Mechanical property of UV curable adhesive bonding in packaging of fiber array waveguide device

SUN Xiao-yan~(1,2),HU You-wang~(1,2),ZENG Xue-fei~1,DUAN Ji-an~(1,2) (1.College of Mechanical and Electrical Engineering,Central South University,Changsha,Hu'nan 410083,China; (2.Key Laboratory of Mmodern Complex Equipment Design and Extreme Manufacturing,Ministry of Education,Changsha,Hu'nan 4101183,China )  
This paper takes the mechanical properties of bonding between fiber array and waveguide chips as the research object.At first,the maximum drawing force,shear force and bending force subjected by the packged device tor different gluing manner of UV curable adhesive were theoretically analysed.Then,simulation analysis for the stress distribution produced by extruding force in the joint was conducted using the finite element analysis software.Based on the comparison and analysis of the results of model calculating and simulating,and considered the economical efficiency,reliability and operability,the optimal manner of gluing on coupling butt-end was provided.
Download(CAJ format) Download(PDF format)
CAJViewer7.0 supports all the CNKI file formats; AdobeReader only supports the PDF format.
©CNKI All Rights Reserved