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《Journal of Synthetic Crystals》 2009-01
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Influence of Interfaces on Thermal Conductivity of Diamond-Cu Composites for Heat Sink Application

XIA Yang,SONG Yue-qing,LIN Chen-guang,CUI Shun (Powder Metallurgy and Special Materials Department,Beijing General Research Institute of Non-ferrous Metals,Beijing 100088,China)  
Diamond-Cu composites were produced by special powder metallurgy technique.Diamond/Cu interface of the composites was investigated by SEM,EDS and Raman spectrum methods in this paper.The results indicate that thermal conductivity of the composites obtained at optimal parameter is about 570W·m-1·K-1.Proper addition of Co could improve interfacial bonding between diamond and Cu during sintering process.As a result of Co diffusion in diamond and solution in Cu melts,transition layers are formed at diamond/Cu interface,which can greatly promote the compatibility between diamond and Cu.Furthermore,diamond skeleton is considered important for ultrahigh thermal properties.
【Fund】: 北京有色金属研究总院科技创新基金
【CateGory Index】: TB332
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