Full-Text Search:
Home|Journal Papers|About CNKI|User Service|FAQ|Contact Us|中文
《Lubrication Engineering》 2009-04
Add to Favorite Get Latest Update

Experimental Study on Parameter Optimization of GaAs Wafer Polishing Using Taguchi Method

Lv Xun1Yu Wei2(1.The MOE Key Laboratory of Mechanical Manufacture and Automation,Zhejiang University of Technology,Hangzhou Zhejiang 310032,China;2.Department of Information and Electrical Engineering,West Branch of Zhejiang University of Technology,Quzhou Zhejiang 324000,China)  
Chemical mechanical polishing method was used to machine GaAs wafer efficiently in order to obtain ultra-smooth GaAs wafer surface.H2O2,CeO2 and NH4OH were used as polishing slurry.Four key parameters,concentration of H2O2,concentration of NH4OH,polishing load and polishing plate speed which influence surface roughness and material removed rate of GaAs wafer were analyzed by Taguchi method and the optimized parameters were gained.The result shows that when the mass fraction of H2O2 is 30%,the mass fraction of NH4OH is 0.08%,the polishing load is 18 kPa and the polishing plate speed is 30 r/min,the optimal polishing efficiency can be obtained.
【CateGory Index】: TG175
Download(CAJ format) Download(PDF format)
CAJViewer7.0 supports all the CNKI file formats; AdobeReader only supports the PDF format.
【Citations】
Chinese Journal Full-text Database 1 Hits
1 LI Xia-zhang~1,CHEN Yang~2,CHEN Zhi-gang~2,CHEN Jian-qing~3,NI Chao-ying~4(1.School of Material Science and Engineering,Jiangsu University,Zhenjiang 212013,China;2.Department of Material Engineering,Jiangsu Polytechnic University,Changzhou 213016,China;3.Department of Material Engineering,Hehai University,Nanjing 210098,China;4.Department of Material Science and Engineering,University of Delaware,Newark 19716,USA);Preparation of CeO_2 Nanoparticles and Their Chemical Mechanical Polishing as Abrasives[J];Tribology;2007-01
【Co-citations】
Chinese Journal Full-text Database 10 Hits
1 FU Maosheng1,2,LI Yongxiu1,DENG Sujun1,HU Jiandong1(1 Research Center for Rare Earths&Micro/Nano Functional Materials,Nanchang University,Nanchang 330047;2 Department of Environmental and Chemical Engineering,Nanchang Hangkong University,Nanchang 330063);Research Progress in Preparation Methods of Nanometer CeO_2 and Its Mixed Oxides[J];Materials Review;2008-08
2 LU Xiao-wang1,LI Xia-zhang2,CHEN Feng1,NI Chao-ying3,CHEN Zhi-gang1 (1. School of Material Science and Engineering, Jiangsu Polytechnic University, Changzhou 213164, China;2. School of Material Science and Engineering, Jiangsu University, Zhenjiang 212013, China;3. Department of Material Science and Engineering, University of Delaware, Newark 19716, USA);Advances on Hydrothermal Synthesis of Morphology Controllable Nanometer CeO_2[J];Bulletin of the Chinese Ceramic Society;2008-04
3 CHEN Feng~1 LI Xiazhang~2 LU Xiaowang~1 WANG Jianmei~1 NI Chaoying~3 CHEN Zhigang~1(1.School of Material Science and Engineering,Jiangsu Polytechnic University,Changzhou 213164,Jiangsu;2.School of Material Science and Engineering,Jiangsu University,Zhenjiang 212013,Jiangsu,China;3.Department of Material Science and Engineering,University of Delaware,Newark 19716,USA);PREPARATION AND CHARACTERIZATION OF PALYGORSKITE/CeO_2 NANO-COMPOSITE MATERIAL AND ITS CATALYTIC PERFORMANCE[J];Journal of the Chinese Ceramic Society;2009-01
4 Lu Zhong,Chen Yang(Department of Material and Engineering,Jiangsu Polytechnic University,Changzhou 213164,China);Research and Development of Chemical Mechanical Polishing Slurry[J];Semiconductor Technology;2009-12
5 XIAO Bao-qi1,2,LEI Hong1(1.Research Center of Nano-science and Nano-technology,Shanghai University,Shanghai 200444,China;2.School of Environmental and Chemical Engineering,Shanghai University,Shanghai 200444,China);Preparation of Nano SiO_2/CeO_2 Composite Particles and Their Polishing Performance[J];Tribology;2008-02
6 FU Mao-sheng1,2,LI Yong-xiu1,CHEN Wei-fan3,WEI Liang-hua1,HU Jian-dong1(1.Research Center for Rare Earths & Micro/nano Functional Materials,Nanchang University,Nanchang 330047,China;2.Department of Environmental and Chemical Engineering,Nanchang Hangkong University,Nanchang 330063,China;3.School of Materials Science and Engineering,Nanchang University,Nanchang 330047,China);Improvement on Polishing Performance of Ce_(0.8)Zr_(0.2)O_2 Solid Solution Abrasives for ZF7 Optical Glass[J];Tribology;2009-02
7 LONG Ren-wei1,2,CHEN Yang1,2,ZHAO Xiao-bing1,2,CHEN Zhi-gang1(1. Department of material and engineering,Jiangsu polytechnic university Changzhou,Jiangsu 213164,China2. Key laboratory of polymer materials,Changzhou city,Jiangsu 213164,China);Preparation and Characterization of CeO_2@SiO_2 Composite Abrasive and Its Polishing Performance[J];Tribology;2009-05
8 ;The Comparative Study on Super-smooth Surface Performance Measurements Based on Three Different Materials[J];Metrology & Measurement Technique;2009-10
9 CHEN Yang1,2,CHEN Zhi-gang1,CHEN Ai-lian1(1.School of Materials Science and Engineering,Jiangsu Polytechnic University,Changzhou 213164,China;2.Key Laboratory of Polymer Materials of Changzhou,Changzhou 213164,China);Preparation Nano-CeO_2 Particles and Its Polishing Performance for Si(100) and Si(111)[J];Nanotechnology and Precision Engineering;2009-06
10 LU Yushan1,CAI Guangqi2,HUA Lei1(1.Faculty of Mechanical Engineering, Shenyang Institute of Technology,Shenyang 110016,China;2.Northeastern Univdersity);Chemical Mechanical Polishing for Silicon Wafer Planarization by Exerting Partial Region Load[J];Journal of Shenyang Institute of Technology;2003-03
【Co-references】
Chinese Journal Full-text Database 10 Hits
1 ZHAN Yang,ZHOU Guoan (The 45th Research Institute of CETC,East Yanjiao, Beijing 101601,China);Study on Optimum Process of CMP[J];Equipment for Electronic Products Manufacturing;2009-04
2 Wang Dianlong Kong Yueqiang;Cutting Database of Difficult-to-machine MaterialBased on Case-based Reasoning Process[J];Tool Engineering;2005-06
3 Yang Yang Hu Xiaobing Li Jianxun et al;Establish and Research on Cutting Database Based on Rule-Based Reasoning[J];Tool Engineering;2007-11
4 Ren Xiaoping,Liu Zhanqiang,Wan Yi,Ye Hongtao,Pang Jiyou;R&D of Machining Database System for Difficult-to-cut Materials[J];Tool Engineering;2009-10
5 RONG Lie-run (Shanghai Jingan District Staff University, Shanghai 200040);Introduction to Ultraprecision Grinding Polishing Method[J];Aviation Precision Manufacturing Technology;2005-02
6 ;Ultra-Precision Machining Technology of Functional Ceramics[J];Aeronautical Manufacturing Technology;2003-04
7 Zhou Wei Tao Hua Gao Xiaobing;Application Research on Intelligent Optimization Database of Cutting Parameters[J];Aeronautical Manufacturing Technology;2008-18
8 Gu Yonggen (S.J.T.U);A Survey of the AI and DB Working Together[J];;1996-05
9 GONG Aihong~(1,2),CHENG Heping~1,RUAN Jingkui~2,ZHOU Xueliang~2(1.Huazhong University of Science and Technology,Wuhan Hubei 430074,China;2.Hubei Automotive Industries Institute,Shiyan Hubei 442002,China);Research and Development of Optimizing and Database System of Craft Parameter of Auto Die High-speed Milling[J];Machine Tool & Hydraulics;2007-01
10 ;The Ultraprecision Machining Technique towards the 21th Century[J];Mechatronics;2003-02
【Secondary Citations】
Chinese Journal Full-text Database 7 Hits
1 Song Xiaolan, Qiu Guanzhou, Qu Peng, Yang Zhenhua (Central South University, Changsha 410083, China);Kinetic of Grain Growth of CeO_2 Nanocrystalline Prepared by Precipitation Method[J];Rare Metal Materials and Engineering;2005-07
2 Bu Junpeng; Zheng Hongjun; He Hongjia; Wu Rangyuan(Inst. of Semiconductors of Chinese Academy of Sciences, Beijing, 100083, CHN);GaAs Wafer Chemomechanical Polishing Mechanism[J];RESEARCH & PROGRESS OF SOLIA STATE ELECTRONICS;1997-04
3 ZHANG Hong Xia,GAO Hong Gang ,WU Ming Gen (China Institute of Aeronautical Precision Mechanics,Beijing 100076) (  Changchun Institute of Optics and Fine Mechanics, Chinese Academy of Sciences,Changchun 130022);Simulation of Even Material Removal During Eccentric Plane Polishing by a Tin Polisher[J];OPTICS AND PRECISION ENGINEERING;1998-02
4 Zhang Hongxia,Yin Bohua,GaoHonggang et al;The Homogenous Dislodging of Locating Ecoentric Tin lap’s Precision Polishing and Its Analog Calculation.[J];AVIATION PRECISION MANUFACTURING TECHNOLOGY;1998-05
5 CHEN Yang~1, CHEN Jian-qing~2, CHEN Zhi-gang~1, FAN Zhen~3 (1.Department of Material Engineering, Jiangsu Polytechnic University, Changzhou 213016, China; 2.Department of Material Engineering, Hehai University, Nanjing 210098, China; 3.Jiangsu University Zhenjiang School of Mechanical Engineering, Zhenjiang 212013, China);Study on Ultra-Precision Polishing of Silicon Wafer by Nanosized Abrasives[J];Tribology;2004-04
6 LI Xiu-juan, JIN Zhu-ji, KANG Ren-ke, GUO Dong-ming (Key Laboratory for Precision and Non-traditional Machining of Ministry of Education, Dalian University of Technology, Dalian 116024, China);Study on Abrasive Effect in Copper Chemical-Mechanical Polishing[J];Tribology;2005-05
7 XU Jin,LUO Jian-bin(State Key Laboratory of Tribology,Tsinghua University,Beijing 100084,China);An Investigation on the Monocrystalline Silicon Surface Damage Caused by Slurry Erosion[J];Tribology;2006-01
©2006 Tsinghua Tongfang Knowledge Network Technology Co., Ltd.(Beijing)(TTKN) All rights reserved