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《Agricultural Equipment & Vehicle Engineering》 2018-12
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Warpage Analysis and Optimization of Pencil Case Based on Moldflow

Zhao Lianlei;Lan Kaipeng;University of Shanghai for Science and Technology;  
With the pencil case as the analysis object, Creo software was used to make a three-dimensional modeling of the pencil case. The Moldflow software was used to analyze the warp defects of the pencil case. By adjusting and optimizing the pressureholding curve and using orthogonal test method, automatic injection molding process of pencil case was simulated. Based on the target value of the maximum warpage deformation after the plastic parts are formed, through the analysis of the range of the comprehensive evaluation indexes, the four injection molding process parameters including the mold temperature, the melt temperature, the packing pressure and the dwell time are obtained. The results show that the melt temperature and holding pressure are the two factors that affect the warpage of the injection molded products, and the most effective for controlling the shrinkage of the products.
【CateGory Index】: TQ320.662
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