A 3D Stacking Technology Based Reliable Cache Architecture
SUN Yan,SONG Chao,LI Tie-jun,ZHANG Min-xuan(College of Computer,National University of Defense Technology,Changsha 410073,China)
Focused on soft error issue in 3D integrated circuits,this paper analyzed particles tracks and characters when high-energy particles get into 3D stacking chips,and then presented a kind of 3D stacking technology-based reliable Cache architecture R3D-Cache after analyzing soft error vulnerability of each component of Caches.The R3D-Cache can greatly reduce error rate with little area and performance overheads.The analysis results show that the proposed structure can bring down soft error rate of Caches to 5% of original one with 0.52% to 4.17% area overhead,while the performance overhead can be ignored.
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