On Quality Improvement for Single Side Polishing of the 10.16 cm AsGa Wafer Surface
LI Mulang;No.46 Research Institute of China Electronic Group Corporation;
In the semiconductor manufacturing process, to get a smooth and shiny layer surface without damage, wafer surface needs to be polished. According to international practices, semiconductor wafer fine buffing mainly adopts a combined chemical and mechanical polishing process, which brings smooth surface, good polish degree and small mechanical damage. It is reported that there are lots of AsGa materials polishing solution formulas, but restricted by strict processing conditions, the polishing result is not ideal. Experiments were designed and carried out from the aspects of polishing speed, polishing pressure and polishing fluid flow and the results were discussed. Finally, a single side precision polishing process for 10.16 cm AsGa wafers, featuring stableness and good repeatability, was obtained.
【CateGory Index】： TN305.2