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《Journal of Wuyi University(Natural Science Edition)》 2011-01
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Image Acquisition Designing for the Vision Thickness Gauge of the Solder Paste Machine

KOU Guan-zhong,LUO Bing(School of Information Engineering,Wuyi University,Jiangmen 529020,China)  
Structured light-based three-dimensional measurement can quickly and effectively detect solder paste defaults in the SMT assembly line.Image acquisition designing is an important part of the system,which is composed of properly selected cameras,lens and sinusoidal grating projector.Image acquisition subsystem calibration is also necessary and is determined by standard calibration blocks.Experiment results show that the designed image acquisition subsystem can satisfy the precision requirements of 3D measurement.
【Fund】: 教育部广东省产学研项目(2010B090400026);; 江门市科技计划项目(江财工【2010】210号)
【CateGory Index】: TP391.41
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