STUDY ON 96Al_2O_3CERAMIC WITH ELECTROLESS COPPERC PLATING
Yu shangyin;Qin xiaoci(School of Electronics and Information Enginering)(School of Chemical Engineering)
This paper reports for the first time that we have succeededin producing 96 Al_2O_3 ceram-ics with electroless copper plating and studied and measured their various properties. Variousstabilities of electroless copper solutions are investigated by using additives; relationship be-tween deposition rate、film thickness and solution compostion、stablizers is investigated by us-ing microbalance;weldability and resistivity against oxidation of electroless copper plating areinvestigated by using wetting test method;adhesion between substrates and copper plating isdetermined by using pluch test method; relationship between adhesion and rough handling、deposition rate is investigated. The result of the development shows that 96 Al_2O_3 ceramicswith electroless copper plating is good enough to be employed for producing printed circuitboards and can be put into industrial production.
【CateGory Index】： TQ153.14